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FGRS (Figure Tokenized Stock) FGRS (Figure Tokenized Stock)
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Xintec Inc. Xintec Inc.

Xintec Inc.

3374
Rang in aandelen #5073
Xintec Inc., founded in 1998 and based in Taoyuan City, Taiwan, is a leading... Xintec Inc., founded in 1998 and based in Taoyuan City, Taiwan, is a leading specialist in sophisticated wafer-level chip scale packaging (WLCSP) solutions. The company maintains a global presence, serving markets across Asia, the United States, and Europe. Its extensive range of services includes WLCSP for crucial components such as image and environmental sensors. Xintec also provides wafer-level post-passivation interconnection (WLPI) specifically designed for fingerprint and actuator sensors, micro-electromechanical components, power, analog, and RF devices. Additionally, they offer comprehensive wafer testing services. For optical sensors, Xintec delivers advanced chip scale packaging, incorporating features like side-wall interconnects and through-silicon via (TSV) redistribution layer products. These solutions accommodate diverse glass thicknesses and filters, and include glass bonding to wafers, available with or without a cavity. The company is also proficient in various wafer reconstruction methods, including front-side, backside, and stack wafer reconstruction, catering to mobile, automotive, and consumer electronics applications. They further specialize in wafer reconstruction with a glass lid, particularly for the automotive sector. Moreover, Xintec offers highly specialized packaging services for micro-electromechanical systems (MEMS) sensors. This encompasses wafer thinning, precise partial dicing of bonded wafers to expose bonding pads, and CSP utilizing via-last TSV for connecting pads from the wafer surface to the backside. They also employ dry etching of silicon to form large cavities, enhancing product performance. Supplementary offerings include 3D I/O redistribution, power and ground enhancement, and dual-side connection capabilities. Xintec's cutting-edge technologies are integral to a wide array of electronic products, such as tablets, notebooks, computers, and medical equipment.
Aandeelprijs
$11.19
Marktkapitalisatie
$3.04B
Verandering (1 dag)
5.55%
Verandering (1 jaar)
146.30%
Land
TW
Handel Xintec Inc. (3374)

Categorie

Technology
Aandelsplitsingen voor Xintec Inc. (3374)
Het aandeel Xintec Inc. (symbool: 3374) heeft in totaal 0 splitsingen ondergaan.
De meest recente splitsing vond plaats op Aug 27, 2026.
Eén aandeel 3374 dat vóór Aug 27, 2026 werd gekocht, staat nu gelijk aan 0 aandelen 3374.
Lijst van aandelen splitsingen
Jaar Splitsing Vermenigvuldiging Cumulatieve vermenigvuldiging
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