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Winstek Semiconductor Co., Ltd. Winstek Semiconductor Co., Ltd.

Winstek Semiconductor Co., Ltd.

3265
Rang in aandelen #10622
Winstek Semiconductor Co., Ltd., along with its various subsidiaries, offers... Winstek Semiconductor Co., Ltd., along with its various subsidiaries, offers extensive services in Taiwan, specializing in integrated circuit (IC) testing, wafer bumping, and wafer packaging. Their comprehensive test division provides initial wafer sorting, thorough final and post-production testing, dedicated engineering assistance, and access to advanced test platforms. For wafer bumping, the company delivers a diverse range of solutions, including copper pillar bumps, wafer-level chip scale packaging (WLCSP), lead-free options, plating bump/ball drop/RDL, 6S protection, heterogeneous bumps, and backside metallization. Furthermore, Winstek provides crucial backend services such as die processing, wafer thinning, singulation, and flip-chip integration. They also conduct detailed verification and analysis, which includes failure analysis and reliability assessments. Established in 2000, the company was initially known as Stats ChipPac Taiwan Semiconductor Corp. before officially rebranding to Winstek Semiconductor Co., Ltd. in June 2015. Its main operations are based in Hsinchu City, Taiwan, and it operates as an affiliate of SIGWIN Corporation.
Aandeelprijs
$5.93
Laatst gesynchroniseerd: 2026-08-28
Marktkapitalisatie
$808.10M
Verandering (1 dag)
5.67%
Verandering (1 jaar)
76.93%
Land
TW
Handel Winstek Semiconductor Co., Ltd. (3265)

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EPS voor Winstek Semiconductor Co., Ltd. (3265)
EPS per 2026 TTM: 0
Volgens de laatste financiële rapporten en de aandelenkoers van Winstek Semiconductor Co., Ltd. is de huidige EPS van het bedrijf (TTM) 0. Eind 2026 had het bedrijf een EPS van 0, gelijk aan de EPS van 2026 die 0 bedroeg.
EPS-geschiedenis van Winstek Semiconductor Co., Ltd. van 2026 tot 2026
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