Kinsus Interconnect Technology Corp.
3189
Rang in aandelen
#1329
Kinsus Interconnect Technology Corp., together with its subsidiaries, engages... Kinsus Interconnect Technology Corp., together with its subsidiaries, engages in the manufacture and sale of electronic products in Taiwan and internationally. It operates through the IC Substrate and Optics segments. The company offers system in package substrate, a carrier substrate that provides a platform for multiple chips or packages or passive components assembly for multi-chip module, multi-chip package, stack die, package in package, and embedded substrates, as well as modules in handset and wearable devices. It also provides plastic ball grid array substrate for microprocessors, controllers, graphic processors, ASIC, and PC chipsets; and flip chip chip scale package substrate for application processors and connectivity applications. In addition, the company offers wire bond chip scale package substrate for application processor, connectivity, power management, and memory applications; radio frequency modules substrate for power amplifier, front end modules, and Wi-Fi connectivity modules applications; and flip chip ball grid array substrate for micro and graphic processors, ASIC, and field programmable gate array applications. In addition, the company is involved in the manufacture and sale of medical equipment; research, development, manufacture, production, and sale of printed circuit boards, electronic components, and related products, as well as provision of after-sales services; and sale of cosmetic products. Further, it is involved in the wholesale and retail-sale of electronic materials; provision of business operation and management consultation services; production, manufacture, and sale of contact lenses; and investment and trading activities. The company was incorporated in 2000 and is based in Taoyuan City, Taiwan.
Aandeelprijs
$32.12
Marktkapitalisatie
$16.92B
Verandering (1 dag)
6.88%
Verandering (1 jaar)
557.29%
Land
TW
Handel Kinsus Interconnect Technology Corp. (3189)
Categorie
Technology
Aandelsplitsingen voor Kinsus Interconnect Technology Corp. (3189)
Het aandeel Kinsus Interconnect Technology Corp. (symbool: 3189) heeft in totaal 4 splitsingen ondergaan.
De meest recente splitsing vond plaats op Jul 24, 2007.
Eén aandeel 3189 dat vóór Jul 25, 2005 werd gekocht, staat nu gelijk aan 1.46107281408 aandelen 3189.
De meest recente splitsing vond plaats op Jul 24, 2007.
Eén aandeel 3189 dat vóór Jul 25, 2005 werd gekocht, staat nu gelijk aan 1.46107281408 aandelen 3189.
Lijst van aandelen splitsingen
| Jaar | Splitsing | Vermenigvuldiging | Cumulatieve vermenigvuldiging |
|---|---|---|---|
| 2007-07-24 | 11:10 | x1.1 | x1.46107281408 |
| 2006-08-02 | 140991:125000 | x1.127928 | x1.3282480128 |
| 2006-04-11 | 128:125 | x1.024 | x1.1776 |
| 2005-07-25 | 23:20 | x1.15 | x1.15 |
Aandelsplitsingen van vergelijkbare bedrijven of concurrenten
| Bedrijf | Aantal aandelen splitsingen | Cumulatieve vermenigvuldiging | Land |
|---|---|---|---|
| 6 | x480 |
US
|
|
| 11 | x12 |
TW
|
|
| 1 | x10 |
US
|
|
| 3 | x10 |
US
|
|
| 6 | x26 |
US
|
