LB Semicon, Inc.
061970
Rang in aandelen
#19169
LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South... LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South Korea. It offers wafer-level packaging technology for packaging and testing integrated circuits; gold bumped wafers, which are applied on various packages, such as chip on glass, chip on film, and chip on plastic; solder bumps for various flip chip packages; Cu pillar bumps; Au RDL, which is used to reposition the layout of the I/O pad; and thick Cu products. The company also provides chip probe test; and back-end services, such as laminating, back grinding, laser marking and grooving, SAW, plasma, post AVI, UV irradiation, pick and place, AVI, visual inspection and packing services, as well as back side coating, foil mount, and tape and reel. LB Semicon Inc. was founded in 2000 and is based in Pyeongtaek-Si, South Korea.
Aandeelprijs
$2.31
Marktkapitalisatie
$161.86M
Verandering (1 dag)
1.21%
Verandering (1 jaar)
-37.84%
Land
KR
Handel LB Semicon, Inc. (061970)
Categorie
Technology
P/B-ratio voor LB Semicon, Inc. (061970)
P/B-ratio op 2026 TTM: 0
Volgens de meest recente financiële rapporten en aandelenkoers van LB Semicon, Inc. is de huidige P/B-ratio (TTM) 0. Eind 2026 had het bedrijf een P/B-ratio van 0.
P/B-ratiohistoriek voor LB Semicon, Inc. van 2026 tot 2026
P/B-ratio aan het einde van elk jaar
| Jaar | P/B-ratio | Wijzigen |
|---|---|---|
| Niet genoeg gegevens voor de verstrekte datums. | ||
P/B-ratio voor vergelijkbare bedrijven of concurrenten
| Bedrijf | P/B-ratio | Verschil in P/B-ratio | Land |
|---|---|---|---|
| 23.3783 | - |
US
|
|
| 9.8357 | - |
TW
|
|
| 16.5536 | - |
US
|
|
| 7.4648 | - |
US
|
|
| 13.8493 | - |
US
|
