LB Semicon, Inc.
061970
Rang in aandelen
#19236
LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South... LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South Korea. It offers wafer-level packaging technology for packaging and testing integrated circuits; gold bumped wafers, which are applied on various packages, such as chip on glass, chip on film, and chip on plastic; solder bumps for various flip chip packages; Cu pillar bumps; Au RDL, which is used to reposition the layout of the I/O pad; and thick Cu products. The company also provides chip probe test; and back-end services, such as laminating, back grinding, laser marking and grooving, SAW, plasma, post AVI, UV irradiation, pick and place, AVI, visual inspection and packing services, as well as back side coating, foil mount, and tape and reel. LB Semicon Inc. was founded in 2000 and is based in Pyeongtaek-Si, South Korea.
Aandeelprijs
$2.28
Marktkapitalisatie
$159.92M
Verandering (1 dag)
-5.98%
Verandering (1 jaar)
-40.84%
Land
KR
Handel LB Semicon, Inc. (061970)
Categorie
Technology
Dividendrendementgeschiedenis voor LB Semicon, Inc. (061970)
Het dividendrendement (TTM) van LB Semicon, Inc. (aandelsymbool: 061970) per 2026 is: 0
Gemiddeld dividendrendement over de afgelopen 5 jaar: 0.00%
Gemiddeld dividendrendement over de afgelopen 5 jaar: 0.00%
Dividendrendementgeschiedenis van LB Semicon, Inc. (061970) van 2026 tot 2026
Dividendrendement aan het einde van elk jaar (TTM)
| Jaar | Dividendrendement | Wijzigen |
|---|---|---|
| Niet genoeg gegevens voor de verstrekte datums. | ||
Dividendrendementen (TTM) van vergelijkbare bedrijven of concurrenten
| Bedrijf | Dividendrendement | Land |
|---|---|---|
| 0.23% |
US
|
|
| 0.98% |
TW
|
|
| 0.75% |
US
|
|
| 0.06% |
US
|
|
| 0.00% |
US
|
