BE Semiconductor Industries N.V. BE Semiconductor Industries N.V.

BE Semiconductor Industries N.V.

BESI

Kedudukan dalam Saham #1456
BE Semiconductor Industries N.V. (BESI) specializes in the creation,... BE Semiconductor Industries N.V. (BESI) specializes in the creation, manufacturing, global distribution, and servicing of advanced machinery vital for semiconductor assembly within the electronics and chip manufacturing industries. Its extensive product portfolio features sophisticated die attach equipment, encompassing systems for single-chip, multi-chip, multi-module, flip-chip, thermal compression bonding, fan-out wafer level packaging, hybrid and embedded bridge die bonding, and die sorting. Additionally, BESI provides a variety of packaging solutions, including conventional, ultra-thin, and wafer-level molding, alongside trim and form, and singulation systems. The company also offers plating equipment for tin, copper, precious metals, and solar applications, complete with their corresponding process chemicals. Supplemental to its core machinery, BESI supplies critical tooling, conversion kits, spare components, and various support services. With well-known brand names like Datacon, Esec, Fico, and Meco, the company primarily serves major multinational chip producers, assembly outsourcing specialists, and diverse electronics and industrial enterprises. Established in 1995, BE Semiconductor Industries N.V. maintains its headquarters in Duiven, Netherlands.
Harga Saham
$189.73
Disegerakkan terakhir: 2026-10-19
Modal Pasaran
$15.01B
Perubahan (1 hari)
2.83%
Perubahan (1 tahun)
40.94%
Negara
NL
Perdagangan BE Semiconductor Industries N.V. (BESI)

Kategori

Technology
Sejarah dividen untuk BE Semiconductor Industries N.V. (BESI)
BE Semiconductor Industries N.V. (simbol saham: BESI) telah membuat sejumlah 0 pembayaran dividen.
Jumlah semua dividen (disesuaikan untuk pemecahan saham): 0.00
Hasil dividen (TTM): 0
Pembayaran dividen untuk BE Semiconductor Industries N.V. (BESI) dari 2026 hingga 2026
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