Amkor Technology, Inc. Amkor Technology, Inc.

Amkor Technology, Inc.

AMKR

Kedudukan dalam Saham #2006
Amkor Technology, Inc. operates internationally, delivering external... Amkor Technology, Inc. operates internationally, delivering external semiconductor packaging and testing solutions across North America, Japan, Europe, the Middle East, Africa, and the broader Asia Pacific region. Their comprehensive, end-to-end offerings encompass a range of processes, including semiconductor wafer bumping, probing, back-grinding, package conceptualization, final packaging, testing, and direct shipment services. The company's product portfolio features flip-chip scale packages, critical for devices like smartphones, tablets, and other portable consumer electronics. They also provide flip-chip stacked chip-scale packages, designed for layering memory atop digital basebands and as application processors in mobile units. Flip-chip ball grid array packages cater to diverse applications in networking, data storage, computing, and general consumer products. Wafer-level CSP packages find use in power management systems, transceivers, sensors, wireless charging technologies, codecs, radar systems, and specialized silicon components. Their wafer-level fan-out packages are integral for integrated circuits, alongside silicon wafer integrated fan-out technology, which offers a thinner alternative to traditional laminate substrates. Additionally, Amkor supplies lead frame packages, commonly employed in electronic devices requiring low to medium pin count analog and mixed-signal functionalities. Substrate-based wirebond packages facilitate the connection of a die to its substrate. Micro-electro-mechanical systems (MEMS) packages involve miniature mechanical and electromechanical components. Furthermore, their advanced system-in-package (SiP) modules are vital for a broad array of applications, including radio frequency and front-end modules, basebands, connectivity solutions, fingerprint sensors, display and touchscreen drivers, various sensors and MEMS, and NAND memory and solid-state drives. The company primarily serves a clientele comprising integrated device manufacturers, fabless semiconductor enterprises, original equipment manufacturers, and contract foundries. Established in 1968, Amkor Technology, Inc. maintains its corporate headquarters in Tempe, Arizona.
Harga Saham
$41.97
Disegerakkan terakhir: 2026-10-20
Modal Pasaran
$10.43B
Perubahan (1 hari)
0.19%
Perubahan (1 tahun)
30.54%
Negara
US
Perdagangan Amkor Technology, Inc. (AMKR)

Kategori

Technology
Hasil untuk Amkor Technology, Inc. (AMKR)
Hasil pada Jun 2026 TTM: $7.46B
Menurut laporan kewangan terkini daripada Amkor Technology, Inc., hasil semasa syarikat (TTM) ialah $7.46B. Pada tahun 2024, syarikat memperoleh hasil sebanyak $6.32B penurunan berbanding hasil pada tahun 2023 iaitu $6.50B. Hasil ialah jumlah pendapatan keseluruhan yang dijana oleh syarikat daripada jualan barangan atau perkhidmatan. Tidak seperti keuntungan, tiada perbelanjaan ditolak.
Sejarah hasil bagi Amkor Technology, Inc. dari 2000 hingga 2026
Hasil pada akhir setiap tahun
Tahun Hasil Ubah
2026 (TTM) $7.46B 11.18%
2025 $6.71B 6.18%
2024 $6.32B -2.85%
2023 $6.50B -8.30%
2022 $7.09B 15.53%
2021 $6.14B 21.54%
2020 $5.05B 24.62%
2019 $4.05B -6.11%
2018 $4.32B 3.10%
2017 $4.19B 7.52%
2016 $3.89B 34.98%
2015 $2.88B -7.82%
2014 $3.13B 5.85%
2013 $2.96B 7.12%
2012 $2.76B -0.59%
2011 $2.78B -5.55%
2010 $2.94B 34.89%
2009 $2.18B -18.04%
2008 $2.66B -2.95%
2007 $2.74B 0.40%
2006 $2.73B 29.93%
2005 $2.10B 10.45%
2004 $1.90B 18.55%
2003 $1.60B -2.19%
2002 $1.64B 8.03%
2001 $1.52B -36.42%
2000 $2.39B 0.00%
Hasil untuk syarikat atau pesaing serupa
Syarikat Hasil Perbezaan Hasil Negara
$302.97B 3,962.51%
US
$141.20B 1,793.39%
TW
$89.10B 1,094.80%
US
$133.19B 1,685.92%
US
$41.31B 453.86%
US