Lasertec Corporation
6920
Kedudukan dalam Saham
#1057
Lasertec Corporation operates globally, specializing in the development,... Lasertec Corporation operates globally, specializing in the development, production, sale, and servicing of advanced equipment for the semiconductor industry, flat panel displays, and sophisticated laser microscopes. Within the semiconductor sector, Lasertec offers essential systems designed for the inspection and precise measurement of defects found on semiconductor photomasks and wafers. Its comprehensive wafer-related solutions include specialized systems for materials like SiC and GaN, multi-wavelength analysis, and both wafer edge inspection and review. The company also provides advanced equipment for wafer bump inspection and measurement, as well as systems for TSV back grinding process measurement. Beyond semiconductors, Lasertec develops inspection systems specifically for flat panel display photomasks. Its acclaimed laser microscopes are utilized for the detailed observation and measurement of a broad spectrum of materials and components, encompassing semiconductor substrates, transparent films, various coating materials, inorganic and organic compounds, biological samples, metallic parts, and plastic elements. The company's product line also extends to include lithium-ion batteries. Originally established in 1960 as NJS Corporation, the company officially rebranded to Lasertec Corporation in 1986. Its corporate headquarters are situated in Yokohama, Japan.
Harga Saham
$243.53
Modal Pasaran
$21.83B
Perubahan (1 hari)
-3.27%
Perubahan (1 tahun)
72.79%
Negara
JP
Perdagangan Lasertec Corporation (6920)
Kategori
Technology
Sejarah dividen untuk Lasertec Corporation (6920)
Lasertec Corporation (simbol saham: 6920) telah membuat sejumlah 0 pembayaran dividen.
Jumlah semua dividen (disesuaikan untuk pemecahan saham): 0.00
Hasil dividen (TTM): 0
Jumlah semua dividen (disesuaikan untuk pemecahan saham): 0.00
Hasil dividen (TTM): 0
Pembayaran dividen untuk Lasertec Corporation (6920) dari 2026 hingga 2026
Pembayaran dividen tahunan
| Tahun | Dividen (diselaraskan untuk pemecahan saham) | Ubah |
|---|---|---|
| Tidak cukup data untuk tarikh yang disediakan. | ||
Senarai semua pembayaran dividen
| Tahun | Dividen | Ubah |
|---|---|---|
| Tidak cukup data untuk tarikh yang disediakan. | ||
Pembayaran dividen untuk syarikat serupa atau pesaing
| Syarikat | Jumlah pembayaran dividen | Negara |
|---|---|---|
| 56.00% |
US
|
|
| 46.00% |
TW
|
|
| 64.00% |
US
|
|
| 34.00% |
US
|
|
| 2.00% |
US
|
