Hwatsing Technology Co., Ltd.
688120
Kedudukan dalam Saham
#1376
Hwatsing Technology Co., Ltd. engages in the research, development, production,... Hwatsing Technology Co., Ltd. engages in the research, development, production, sales, and technical services of semiconductor equipment in China and internationally. The company offers chemical mechanical polishers, implanters, grinders, bevel polishers, dicers, wet process and film metrology equipment, wafer regeneration and reclaim services, and consumables and maintenance services. Its products are mainly used in integrated circuits, advanced packaging, advanced packaging, large silicon wafers, MEMS, micro-LED, and other third-generation semiconductors. The company was founded in 2013 and is headquartered in Tianjin, China.
Harga Saham
$31.17
Modal Pasaran
$15.94B
Perubahan (1 hari)
-3.19%
Perubahan (1 tahun)
119.50%
Negara
CN
Perdagangan Hwatsing Technology Co., Ltd. (688120)
Kategori
Technology
Sejarah dividen untuk Hwatsing Technology Co., Ltd. (688120)
Hwatsing Technology Co., Ltd. (simbol saham: 688120) telah membuat sejumlah 4 pembayaran dividen.
Jumlah semua dividen (disesuaikan untuk pemecahan saham): $1.09
Hasil dividen (TTM): 0.0019
Jumlah semua dividen (disesuaikan untuk pemecahan saham): $1.09
Hasil dividen (TTM): 0.0019
Pembayaran dividen untuk Hwatsing Technology Co., Ltd. (688120) dari 2023 hingga 2026
Pembayaran dividen tahunan
| Tahun | Dividen (diselaraskan untuk pemecahan saham) | Ubah |
|---|---|---|
| 2026 (TTM) | $0.4 | 51.69% |
| 2025 | $0.2637 | 0.00% |
| 2024 | $0.2637 | 63.89% |
| 2023 | $0.1609 | 0.00% |
Senarai semua pembayaran dividen
| Tahun | Dividen | Ubah |
|---|---|---|
| 2026 (TTM) | $0.56 | 51.72% |
| 2025 | $0.3691 | 0.00% |
| 2024 | $0.3691 | 63.90% |
| 2023 | $0.2252 | 0.00% |
Pembayaran dividen untuk syarikat serupa atau pesaing
| Syarikat | Jumlah pembayaran dividen | Negara |
|---|---|---|
| 56.00% |
US
|
|
| 46.00% |
TW
|
|
| 64.00% |
US
|
|
| 34.00% |
US
|
|
| 2.00% |
US
|
