Chipbond Technology Corporation
6147
Kedudukan dalam Saham
#3491
Chipbond Technology Corporation, along with its affiliated entities,... Chipbond Technology Corporation, along with its affiliated entities, specializes in the research, development, manufacturing, and global distribution of various semiconductor components. Their product portfolio includes advanced metal, gold, and tin-lead bumps, as well as flip chips, tape and reel bonding solutions, and packaging substrates. Operating across Taiwan, the United States, and other international markets, the company delivers comprehensive turnkey services. These encompass diverse bumping manufacturing services (such as gold, solder, and copper bumping), redistribution layer (RDL) processing, and specialized wafer surface treatments like backside metal and dielectric layer coating. Furthermore, they provide wafer grinding, dicing, and precise picking and placing services. Their offerings extend to extensive package and testing services, covering both driver and non-driver integrated circuit testing, driver IC packaging, and wafer-level chip scale packaging (WLCSP). Complementing these are services such as final inspection, detailed failure analysis, and the design and production of chip trays. Beyond these core activities, Chipbond Technology Corporation also engages in the investment, development, manufacturing, and sale of electronic components. They are involved in the entire lifecycle of integrated circuit products and semiconductor-specific materials, from development and production to packaging, testing, and providing after-sales support. Additionally, the company supplies semiconductor components, offers packaging and testing services for semiconductors, and provides various electronic, computer, and communication circuit boards. Established in 1997, the company maintains its headquarters in Hsinchu, Taiwan.
Harga Saham
$6.63
Disegerakkan terakhir: 2026-10-19
Modal Pasaran
$4.94B
Perubahan (1 hari)
0.24%
Perubahan (1 tahun)
249.26%
Negara
TW
Perdagangan Chipbond Technology Corporation (6147)
Kategori
Technology
Nisbah P/E bagi Chipbond Technology Corporation (6147)
Nisbah P/E pada October 2026 TTM: 51.56
Menurut laporan kewangan dan harga saham terkini Chipbond Technology Corporation, nisbah P/E semasa (TTM) ialah 51.56. Pada akhir 2023, syarikat mempunyai nisbah P/E sebanyak 13.36.
Sejarah nisbah P/E bagi Chipbond Technology Corporation dari 2006 hingga 2026
Nisbah P/E pada akhir setiap tahun
| Tahun | Nisbah P/E | Ubah |
|---|---|---|
| 2026 (TTM) | 51.56 | 347.59% |
| 2024 | 11.52 | -13.82% |
| 2023 | 13.36 | 95.69% |
| 2022 | 6.83 | -7.87% |
| 2021 | 7.41 | -37.42% |
| 2020 | 11.84 | 10.67% |
| 2019 | 10.70 | 20.12% |
| 2018 | 8.91 | -45.16% |
| 2017 | 16.25 | 8.49% |
| 2016 | 14.98 | 0.42% |
| 2015 | 14.91 | 1.59% |
| 2014 | 14.68 | 29.69% |
| 2013 | 11.32 | -15.69% |
| 2012 | 13.43 | 36.83% |
| 2011 | 9.81 | -12.17% |
| 2010 | 11.17 | -57.79% |
| 2009 | 26.46 | -23.76% |
| 2008 | 34.71 | 280.23% |
| 2007 | 9.13 | -25.74% |
| 2006 | 12.29 | 0.00% |
Nisbah P/E untuk syarikat serupa atau pesaing
| Syarikat | Nisbah P/E | Perbezaan Nisbah P/E | Negara |
|---|---|---|---|
| 27.84 | -46.01% |
US
|
|
| 28.28 | -45.15% |
TW
|
|
| 42.96 | -16.69% |
US
|
|
| 12.14 | -76.46% |
US
|
|
| 144.88 | 180.98% |
US
|
Cara membaca nisbah P/E
Nisbah Harga/Perolehan (P/E) mengukur hubungan antara harga saham syarikat dan pendapatan sesaham.
P/E yang rendah tetapi positif menunjukkan syarikat menjana keuntungan tinggi berbanding dengan penilaian semasa dan mungkin dinilai rendah. P/E negatif yang tinggi (hampir 0) menunjukkan kerugian besar.
Syarikat dengan P/E melebihi 30 atau negatif biasanya dilihat sebagai "saham pertumbuhan", bermaksud pelabur menjangkakan pertumbuhan atau keuntungan masa depan.
Syarikat dengan P/E positif di bawah 10 biasanya dianggap sebagai "saham nilai", bermaksud syarikat sudah menguntungkan dan tidak dijangka berkembang pesat.