Chipbond Technology Corporation
6147
Kedudukan dalam Saham
#3500
Chipbond Technology Corporation, along with its affiliated entities,... Chipbond Technology Corporation, along with its affiliated entities, specializes in the research, development, manufacturing, and global distribution of various semiconductor components. Their product portfolio includes advanced metal, gold, and tin-lead bumps, as well as flip chips, tape and reel bonding solutions, and packaging substrates. Operating across Taiwan, the United States, and other international markets, the company delivers comprehensive turnkey services. These encompass diverse bumping manufacturing services (such as gold, solder, and copper bumping), redistribution layer (RDL) processing, and specialized wafer surface treatments like backside metal and dielectric layer coating. Furthermore, they provide wafer grinding, dicing, and precise picking and placing services. Their offerings extend to extensive package and testing services, covering both driver and non-driver integrated circuit testing, driver IC packaging, and wafer-level chip scale packaging (WLCSP). Complementing these are services such as final inspection, detailed failure analysis, and the design and production of chip trays. Beyond these core activities, Chipbond Technology Corporation also engages in the investment, development, manufacturing, and sale of electronic components. They are involved in the entire lifecycle of integrated circuit products and semiconductor-specific materials, from development and production to packaging, testing, and providing after-sales support. Additionally, the company supplies semiconductor components, offers packaging and testing services for semiconductors, and provides various electronic, computer, and communication circuit boards. Established in 1997, the company maintains its headquarters in Hsinchu, Taiwan.
Harga Saham
$6.61
Disegerakkan terakhir: 2026-10-16
Modal Pasaran
$4.92B
Perubahan (1 hari)
-2.12%
Perubahan (1 tahun)
253.64%
Negara
TW
Perdagangan Chipbond Technology Corporation (6147)
Kategori
Technology
Sejarah dividen untuk Chipbond Technology Corporation (6147)
Chipbond Technology Corporation (simbol saham: 6147) telah membuat sejumlah 16 pembayaran dividen.
Jumlah semua dividen (disesuaikan untuk pemecahan saham): $51.03
Hasil dividen (TTM): 0.0131
Jumlah semua dividen (disesuaikan untuk pemecahan saham): $51.03
Hasil dividen (TTM): 0.0131
Pembayaran dividen untuk Chipbond Technology Corporation (6147) dari 2008 hingga 2026
Pembayaran dividen tahunan
| Tahun | Dividen (diselaraskan untuk pemecahan saham) | Ubah |
|---|---|---|
| 2026 (TTM) | $3.75 | 0.00% |
| 2025 | $3.75 | 0.01% |
| 2024 | $3.75 | -31.82% |
| 2023 | $5.50 | -8.33% |
| 2022 | $6.00 | 57.89% |
| 2021 | $3.80 | -9.52% |
| 2020 | $4.20 | 20.00% |
| 2019 | $3.50 | 48.94% |
| 2018 | $2.35 | 11.90% |
| 2017 | $2.10 | 0.00% |
| 2016 | $2.10 | -19.23% |
| 2015 | $2.60 | 0.00% |
| 2014 | $2.60 | 0.01% |
| 2013 | $2.60 | 30.01% |
| 2012 | $2.00 | -0.02% |
| 2011 | $2.00 | -8.08% |
| 2008 | $2.18 | 0.00% |
Senarai semua pembayaran dividen
| Tahun | Dividen | Ubah |
|---|---|---|
| 2026 (TTM) | $3.75 | 0.00% |
| 2025 | $3.75 | 0.01% |
| 2024 | $3.75 | -31.82% |
| 2023 | $5.50 | -8.33% |
| 2022 | $6.00 | 57.89% |
| 2021 | $3.80 | -9.52% |
| 2020 | $4.20 | 20.00% |
| 2019 | $3.50 | 48.94% |
| 2018 | $2.35 | 11.90% |
| 2017 | $2.10 | 0.00% |
| 2016 | $2.10 | -19.23% |
| 2015 | $2.60 | 0.00% |
| 2014 | $2.60 | 0.01% |
| 2013 | $2.60 | 30.01% |
| 2012 | $2.00 | -0.02% |
| 2011 | $2.00 | -8.08% |
| 2008 | $2.18 | 0.00% |
Pembayaran dividen untuk syarikat serupa atau pesaing
| Syarikat | Jumlah pembayaran dividen | Negara |
|---|---|---|
| 53.00% |
US
|
|
| 44.00% |
TW
|
|
| 61.00% |
US
|
|
| 31.00% |
US
|
|
| 1.00% |
US
|
