HPSP Co., Ltd.
403870
Kedudukan dalam Saham
#5065
HPSP Co., Ltd. is an enterprise engaged in the manufacturing and global sales... HPSP Co., Ltd. is an enterprise engaged in the manufacturing and global sales of specialized high-pressure annealing equipment for the semiconductor industry, serving markets in South Korea and worldwide. Its product lineup encompasses the GENI-SYS, an advanced high-pressure thermal processing unit, alongside the GENI high-pressure thermal processing system, and the GENI-SE, which is designed for high-pressure oxidation applications. Furthermore, the company provides comprehensive support services such as the supply of spare parts, repair and exchange programs for components, assistance with installation, and ongoing technical guidance. Established in 2005, HPSP Co., Ltd. operates from its headquarters in Suwon, South Korea.
Harga Saham
$34.99
Modal Pasaran
$2.85B
Perubahan (1 hari)
1.20%
Perubahan (1 tahun)
39.35%
Negara
KR
Perdagangan HPSP Co., Ltd. (403870)
Kategori
Technology
Sejarah pecahan saham untuk HPSP Co., Ltd. (403870)
Saham HPSP Co., Ltd. (simbol: 403870) telah mengalami sejumlah 1 pecahan saham.
Pecahan saham terkini berlaku pada Mar 16, 2023.
Satu saham 403870 yang dibeli sebelum Mar 16, 2023 kini bersamaan dengan 4 saham 403870.
Pecahan saham terkini berlaku pada Mar 16, 2023.
Satu saham 403870 yang dibeli sebelum Mar 16, 2023 kini bersamaan dengan 4 saham 403870.
Senarai pecahan saham
| Tahun | Pecahan | Gandaan | Gandaan Kumulatif |
|---|---|---|---|
| 2023-03-16 | 4:1 | x4 | x4 |
Pecahan saham untuk syarikat pesaing atau serupa
| Syarikat | Bilangan pecahan saham | Gandaan Kumulatif | Negara |
|---|---|---|---|
| 6 | x480 |
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| 11 | x12 |
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| 1 | x10 |
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| 3 | x10 |
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| 6 | x26 |
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