HPSP Co., Ltd. HPSP Co., Ltd.

HPSP Co., Ltd.

403870

Kedudukan dalam Saham #5105
HPSP Co., Ltd. is an enterprise engaged in the manufacturing and global sales... HPSP Co., Ltd. is an enterprise engaged in the manufacturing and global sales of specialized high-pressure annealing equipment for the semiconductor industry, serving markets in South Korea and worldwide. Its product lineup encompasses the GENI-SYS, an advanced high-pressure thermal processing unit, alongside the GENI high-pressure thermal processing system, and the GENI-SE, which is designed for high-pressure oxidation applications. Furthermore, the company provides comprehensive support services such as the supply of spare parts, repair and exchange programs for components, assistance with installation, and ongoing technical guidance. Established in 2005, HPSP Co., Ltd. operates from its headquarters in Suwon, South Korea.
Harga Saham
$34.57
Modal Pasaran
$2.81B
Perubahan (1 hari)
-4.58%
Perubahan (1 tahun)
35.51%
Negara
KR
Perdagangan HPSP Co., Ltd. (403870)

Kategori

Technology
Sejarah dividen untuk HPSP Co., Ltd. (403870)
HPSP Co., Ltd. (simbol saham: 403870) telah membuat sejumlah 4 pembayaran dividen.
Jumlah semua dividen (disesuaikan untuk pemecahan saham): $937.50
Hasil dividen (TTM): 0.012
Pembayaran dividen untuk HPSP Co., Ltd. (403870) dari 2022 hingga 2026
Pembayaran dividen tahunan
Tahun Dividen (diselaraskan untuk pemecahan saham) Ubah
2026 (TTM) $600.00 0.00%
2025 $600.00 300.00%
2024 $150.00 300.00%
2023 $37.50 -75.00%
2022 $150.00 0.00%
Senarai semua pembayaran dividen
Tahun Dividen Ubah
2026 (TTM) $600.00 0.00%
2025 $600.00 300.00%
2024 $150.00 300.00%
2023 $37.50 -93.75%
2022 $600.00 0.00%
Pembayaran dividen untuk syarikat serupa atau pesaing