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Taiwan IC Packaging Corporation Taiwan IC Packaging Corporation

Taiwan IC Packaging Corporation

3372
Kedudukan dalam Saham #22494
Taiwan IC Packaging Corporation is dedicated to developing advanced integrated... Taiwan IC Packaging Corporation is dedicated to developing advanced integrated circuit (IC) packaging technologies, particularly focusing on optical and ultra-slim designs. Its extensive product catalog features a wide array of IC package types, including thin small outline (TSOP), small outline (SOP), SSOP/TSSOP, quad flat no-lead (QFN)/dual flat no-lead (DFN), thin PKG, TQFP, quad flat (QFP), LQFP, thermally enhanced versions, and specialized image sensor packages. Beyond these, the firm also offers substrate-based packaging solutions like LGA, VLGA, and packaging for micro-SD and SD cards. Founded in 1998, the company is headquartered in Kaohsiung, Taiwan.
Harga Saham
$0.48016532
Disegerakkan terakhir: 2026-08-21
Modal Pasaran
$87.70M
Perubahan (1 hari)
1.34%
Perubahan (1 tahun)
11.79%
Negara
TW
Perdagangan Taiwan IC Packaging Corporation (3372)

Kategori

Technology
Hasil untuk Taiwan IC Packaging Corporation (3372)
Hasil pada Aug 2026 TTM: 0
Menurut laporan kewangan terkini daripada Taiwan IC Packaging Corporation, hasil semasa syarikat (TTM) ialah 0. Pada tahun 2026, syarikat memperoleh hasil sebanyak 0 sama dengan hasil pada tahun 2026 iaitu 0. Hasil ialah jumlah pendapatan keseluruhan yang dijana oleh syarikat daripada jualan barangan atau perkhidmatan. Tidak seperti keuntungan, tiada perbelanjaan ditolak.
Sejarah hasil bagi Taiwan IC Packaging Corporation dari 2026 hingga 2026
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