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Winstek Semiconductor Co., Ltd. Winstek Semiconductor Co., Ltd.

Winstek Semiconductor Co., Ltd.

3265
Kedudukan dalam Saham #10622
Winstek Semiconductor Co., Ltd., along with its various subsidiaries, offers... Winstek Semiconductor Co., Ltd., along with its various subsidiaries, offers extensive services in Taiwan, specializing in integrated circuit (IC) testing, wafer bumping, and wafer packaging. Their comprehensive test division provides initial wafer sorting, thorough final and post-production testing, dedicated engineering assistance, and access to advanced test platforms. For wafer bumping, the company delivers a diverse range of solutions, including copper pillar bumps, wafer-level chip scale packaging (WLCSP), lead-free options, plating bump/ball drop/RDL, 6S protection, heterogeneous bumps, and backside metallization. Furthermore, Winstek provides crucial backend services such as die processing, wafer thinning, singulation, and flip-chip integration. They also conduct detailed verification and analysis, which includes failure analysis and reliability assessments. Established in 2000, the company was initially known as Stats ChipPac Taiwan Semiconductor Corp. before officially rebranding to Winstek Semiconductor Co., Ltd. in June 2015. Its main operations are based in Hsinchu City, Taiwan, and it operates as an affiliate of SIGWIN Corporation.
Harga Saham
$5.93
Disegerakkan terakhir: 2026-08-28
Modal Pasaran
$808.10M
Perubahan (1 hari)
5.67%
Perubahan (1 tahun)
76.93%
Negara
TW
Perdagangan Winstek Semiconductor Co., Ltd. (3265)

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Sejarah pecahan saham untuk Winstek Semiconductor Co., Ltd. (3265)
Saham Winstek Semiconductor Co., Ltd. (simbol: 3265) telah mengalami sejumlah 0 pecahan saham.
Pecahan saham terkini berlaku pada Aug 30, 2026.
Satu saham 3265 yang dibeli sebelum Aug 30, 2026 kini bersamaan dengan 0 saham 3265.
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Tahun Pecahan Gandaan Gandaan Kumulatif
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Syarikat Bilangan pecahan saham Gandaan Kumulatif Negara
6 x480
US
11 x12
TW
1 x10
US
3 x10
US
1 x0
KR