LB Semicon, Inc.
061970
Kedudukan dalam Saham
#19228
LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South... LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South Korea. It offers wafer-level packaging technology for packaging and testing integrated circuits; gold bumped wafers, which are applied on various packages, such as chip on glass, chip on film, and chip on plastic; solder bumps for various flip chip packages; Cu pillar bumps; Au RDL, which is used to reposition the layout of the I/O pad; and thick Cu products. The company also provides chip probe test; and back-end services, such as laminating, back grinding, laser marking and grooving, SAW, plasma, post AVI, UV irradiation, pick and place, AVI, visual inspection and packing services, as well as back side coating, foil mount, and tape and reel. LB Semicon Inc. was founded in 2000 and is based in Pyeongtaek-Si, South Korea.
Harga Saham
$2.31
Modal Pasaran
$161.61M
Perubahan (1 hari)
1.06%
Perubahan (1 tahun)
-37.94%
Negara
KR
Perdagangan LB Semicon, Inc. (061970)
Kategori
Technology
Bilangan saham terbitan bagi LB Semicon, Inc. (061970)
Bilangan saham terbitan setakat October 2026: 0
Menurut laporan kewangan terkini dan harga saham LB Semicon, Inc., bilangan saham terbitan semasa ialah 0. Pada akhir October 2026, syarikat mempunyai 0 saham terbitan. Bilangan saham terbitan biasanya dipengaruhi oleh pecahan saham dan pembelian balik saham.
Sejarah saham terbitan untuk LB Semicon, Inc. (061970) dari 2026 hingga 2026
Saham terbitan pada akhir setiap tahun
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| Tidak cukup data untuk tarikh yang disediakan. | ||
Saham terbitan bagi syarikat atau pesaing yang serupa
| Syarikat | Saham Terbitan | Perbezaan | Negara |
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| 24.19B | - |
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| 25.93B | - |
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| 4.77B | - |
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| 1.13B | - |
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| 1.63B | - |
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