LB Semicon, Inc.
061970
Kedudukan dalam Saham
#19230
LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South... LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South Korea. It offers wafer-level packaging technology for packaging and testing integrated circuits; gold bumped wafers, which are applied on various packages, such as chip on glass, chip on film, and chip on plastic; solder bumps for various flip chip packages; Cu pillar bumps; Au RDL, which is used to reposition the layout of the I/O pad; and thick Cu products. The company also provides chip probe test; and back-end services, such as laminating, back grinding, laser marking and grooving, SAW, plasma, post AVI, UV irradiation, pick and place, AVI, visual inspection and packing services, as well as back side coating, foil mount, and tape and reel. LB Semicon Inc. was founded in 2000 and is based in Pyeongtaek-Si, South Korea.
Harga Saham
$2.35
Modal Pasaran
$164.52M
Perubahan (1 hari)
2.88%
Perubahan (1 tahun)
-36.82%
Negara
KR
Perdagangan LB Semicon, Inc. (061970)
Kategori
Technology
Nisbah P/S bagi LB Semicon, Inc. (061970)
Nisbah P/S pada 2026 TTM: 0
Menurut laporan kewangan dan harga saham terkini LB Semicon, Inc., nisbah P/S semasa (TTM) ialah 0. Pada akhir 2026, nisbah P/S syarikat ialah 0.
Sejarah nisbah P/S untuk LB Semicon, Inc. dari 2026 hingga 2026
Nisbah P/S pada akhir setiap tahun
| Tahun | Nisbah P/S | Ubah |
|---|---|---|
| Tidak cukup data untuk tarikh yang disediakan. | ||
Nisbah P/S untuk syarikat atau pesaing yang serupa
| Syarikat | Nisbah P/S | Perbezaan Nisbah P/S | Negara |
|---|---|---|---|
| 17.60 | - |
US
|
|
| 14.25 | - |
TW
|
|
| 18.55 | - |
US
|
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| 7.75 | - |
US
|
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| 22.53 | - |
US
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