LB Semicon, Inc.
061970
Kedudukan dalam Saham
#18895
LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South... LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South Korea. It offers wafer-level packaging technology for packaging and testing integrated circuits; gold bumped wafers, which are applied on various packages, such as chip on glass, chip on film, and chip on plastic; solder bumps for various flip chip packages; Cu pillar bumps; Au RDL, which is used to reposition the layout of the I/O pad; and thick Cu products. The company also provides chip probe test; and back-end services, such as laminating, back grinding, laser marking and grooving, SAW, plasma, post AVI, UV irradiation, pick and place, AVI, visual inspection and packing services, as well as back side coating, foil mount, and tape and reel. LB Semicon Inc. was founded in 2000 and is based in Pyeongtaek-Si, South Korea.
Harga Saham
$2.37
Modal Pasaran
$166.07M
Perubahan (1 hari)
2.60%
Perubahan (1 tahun)
-36.00%
Negara
KR
Perdagangan LB Semicon, Inc. (061970)
Kategori
Technology
Sejarah harga saham bagi LB Semicon, Inc. (061970)
Harga penutupan tertinggi: $2.80 pada 2026-10-01
Harga penutupan terendah: $4.06 pada 2011-01-01
Harga penutupan terendah: $4.06 pada 2011-01-01
Sejarah harga saham LB Semicon, Inc. dari 2011 hingga 2026
Prestasi harga saham tahunan
| Tahun | Prestasi |
|---|---|
| 2026 (TTM) | 9.01% |
| 2025 | 18.04% |
| 2024 | -57.42% |
| 2023 | 0.01% |
| 2022 | -48.19% |
| 2021 | 3.57% |
| 2020 | 68.25% |
| 2019 | 85.57% |
| 2018 | 28.67% |
| 2017 | 2.55% |
| 2016 | 115.84% |
| 2015 | -9.05% |
| 2014 | -28.40% |
| 2013 | -49.53% |
| 2012 | 75.42% |
| 2011 | 0.00% |
Harga saham bagi syarikat atau pesaing serupa
| Syarikat | Harga saham | Perubahan 1thn% | Negara |
|---|---|---|---|
| $217.84 | 20.83% |
US
|
|
| $73.94 | 55.79% |
TW
|
|
| $328.49 | -3.47% |
US
|
|
| $889.00 | 347.93% |
US
|
|
| $521.80 | 126.64% |
US
|
