LB Semicon, Inc.
061970
Kedudukan dalam Saham
#19230
LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South... LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South Korea. It offers wafer-level packaging technology for packaging and testing integrated circuits; gold bumped wafers, which are applied on various packages, such as chip on glass, chip on film, and chip on plastic; solder bumps for various flip chip packages; Cu pillar bumps; Au RDL, which is used to reposition the layout of the I/O pad; and thick Cu products. The company also provides chip probe test; and back-end services, such as laminating, back grinding, laser marking and grooving, SAW, plasma, post AVI, UV irradiation, pick and place, AVI, visual inspection and packing services, as well as back side coating, foil mount, and tape and reel. LB Semicon Inc. was founded in 2000 and is based in Pyeongtaek-Si, South Korea.
Harga Saham
$2.35
Modal Pasaran
$164.52M
Perubahan (1 hari)
2.88%
Perubahan (1 tahun)
-36.82%
Negara
KR
Perdagangan LB Semicon, Inc. (061970)
Kategori
Technology
Pendapatan untuk LB Semicon, Inc. (061970)
Pendapatan pada 2026 TTM: 0
Menurut laporan kewangan terkini LB Semicon, Inc., pendapatan semasa syarikat ialah 0. Pada tahun 2026, syarikat memperoleh pendapatan sebanyak 0, sama dengan pendapatan pada tahun 2026 yang berjumlah 0. Pendapatan yang dipaparkan di halaman ini adalah pendapatan sebelum faedah dan cukai atau dikenali sebagai EBIT.
Sejarah pendapatan bagi LB Semicon, Inc. dari 2026 hingga 2026
Pendapatan pada akhir setiap tahun
| Tahun | Pendapatan | Ubah |
|---|---|---|
| Tidak cukup data untuk tarikh yang disediakan. | ||
Pendapatan untuk syarikat atau pesaing serupa
| Syarikat | Pendapatan | Perbezaan Pendapatan | Negara |
|---|---|---|---|
| $229.74B | - |
US
|
|
| $84.84B | - |
TW
|
|
| $40.47B | - |
US
|
|
| $99.73B | - |
US
|
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| $7.56B | - |
US
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