LB Semicon, Inc.
061970
Kedudukan dalam Saham
#18922
LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South... LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South Korea. It offers wafer-level packaging technology for packaging and testing integrated circuits; gold bumped wafers, which are applied on various packages, such as chip on glass, chip on film, and chip on plastic; solder bumps for various flip chip packages; Cu pillar bumps; Au RDL, which is used to reposition the layout of the I/O pad; and thick Cu products. The company also provides chip probe test; and back-end services, such as laminating, back grinding, laser marking and grooving, SAW, plasma, post AVI, UV irradiation, pick and place, AVI, visual inspection and packing services, as well as back side coating, foil mount, and tape and reel. LB Semicon Inc. was founded in 2000 and is based in Pyeongtaek-Si, South Korea.
Harga Saham
$2.26
Modal Pasaran
$158.71M
Perubahan (1 hari)
-6.70%
Perubahan (1 tahun)
-41.29%
Negara
KR
Perdagangan LB Semicon, Inc. (061970)
Kategori
Technology
Sejarah dividen untuk LB Semicon, Inc. (061970)
LB Semicon, Inc. (simbol saham: 061970) telah membuat sejumlah 0 pembayaran dividen.
Jumlah semua dividen (disesuaikan untuk pemecahan saham): 0.00
Hasil dividen (TTM): 0
Jumlah semua dividen (disesuaikan untuk pemecahan saham): 0.00
Hasil dividen (TTM): 0
Pembayaran dividen untuk LB Semicon, Inc. (061970) dari 2026 hingga 2026
Pembayaran dividen tahunan
| Tahun | Dividen (diselaraskan untuk pemecahan saham) | Ubah |
|---|---|---|
| Tidak cukup data untuk tarikh yang disediakan. | ||
Senarai semua pembayaran dividen
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Pembayaran dividen untuk syarikat serupa atau pesaing
| Syarikat | Jumlah pembayaran dividen | Negara |
|---|---|---|
| 53.00% |
US
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| 44.00% |
TW
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| 61.00% |
US
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| 31.00% |
US
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| 1.00% |
US
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