LB Semicon, Inc.
061970
Kedudukan dalam Saham
#18986
LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South... LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South Korea. It offers wafer-level packaging technology for packaging and testing integrated circuits; gold bumped wafers, which are applied on various packages, such as chip on glass, chip on film, and chip on plastic; solder bumps for various flip chip packages; Cu pillar bumps; Au RDL, which is used to reposition the layout of the I/O pad; and thick Cu products. The company also provides chip probe test; and back-end services, such as laminating, back grinding, laser marking and grooving, SAW, plasma, post AVI, UV irradiation, pick and place, AVI, visual inspection and packing services, as well as back side coating, foil mount, and tape and reel. LB Semicon Inc. was founded in 2000 and is based in Pyeongtaek-Si, South Korea.
Harga Saham
$2.41
Modal Pasaran
$168.88M
Perubahan (1 hari)
-3.06%
Perubahan (1 tahun)
-36.55%
Negara
KR
Perdagangan LB Semicon, Inc. (061970)
Kategori
Technology
Modal pasaran bagi LB Semicon, Inc.(061970)
Modal Pasaran: $168.88M
Sehingga October 2026, LB Semicon, Inc. mempunyai modal pasaran sebanyak $168.88M. Ini menjadikan LB Semicon, Inc. syarikat ke-18986th paling bernilai di dunia mengikut data kami. Kapitalisasi pasaran ialah nilai keseluruhan saham syarikat tersenarai yang berada dalam edaran dan lazimnya digunakan untuk menilai nilai syarikat tersebut.
Sejarah modal pasaran LB Semicon, Inc. dari 2011 hingga 2026
061970 berbanding dengan 5 teratas yang paling popular stocks
