Shenzhen Techwinsemi Technology Co., Ltd.
001309
Kedudukan dalam Saham
#1816
Shenzhen Techwinsemi Technology Co., Ltd. focuses its operations on the design,... Shenzhen Techwinsemi Technology Co., Ltd. focuses its operations on the design, research, development, and practical deployment of integrated circuits. The company's core activities include engineering and enhancing flash memory controller chips. Furthermore, it creates and optimizes application solutions for storage modules, which it then distributes to the market. Established in 2008, the firm is headquartered in Shenzhen, China.
Harga Saham
$36.41
Modal Pasaran
$11.56B
Perubahan (1 hari)
4.00%
Perubahan (1 tahun)
36.99%
Negara
CN
Perdagangan Shenzhen Techwinsemi Technology Co., Ltd. (001309)
Kategori
Technology
Sejarah pecahan saham untuk Shenzhen Techwinsemi Technology Co., Ltd. (001309)
Saham Shenzhen Techwinsemi Technology Co., Ltd. (simbol: 001309) telah mengalami sejumlah 4 pecahan saham.
Pecahan saham terkini berlaku pada Oct 13, 2026.
Satu saham 001309 yang dibeli sebelum Jul 13, 2023 kini bersamaan dengan 3.5672 saham 001309.
Pecahan saham terkini berlaku pada Oct 13, 2026.
Satu saham 001309 yang dibeli sebelum Jul 13, 2023 kini bersamaan dengan 3.5672 saham 001309.
Senarai pecahan saham
| Tahun | Pecahan | Gandaan | Gandaan Kumulatif |
|---|---|---|---|
| 2026-10-13 | 7:5 | x1.4 | x3.5672 |
| 2025-07-10 | 7:5 | x1.4 | x2.548 |
| 2024-04-26 | 13:10 | x1.3 | x1.82 |
| 2023-07-13 | 7:5 | x1.4 | x1.4 |
Pecahan saham untuk syarikat pesaing atau serupa
| Syarikat | Bilangan pecahan saham | Gandaan Kumulatif | Negara |
|---|---|---|---|
| 6 | x480 |
US
|
|
| 11 | x12 |
TW
|
|
| 1 | x10 |
US
|
|
| 3 | x10 |
US
|
|
| 6 | x26 |
US
|
