Amkor Technology, Inc.
AMKR
주식 순위
#1994
Amkor Technology, Inc. operates internationally, delivering external... Amkor Technology, Inc. operates internationally, delivering external semiconductor packaging and testing solutions across North America, Japan, Europe, the Middle East, Africa, and the broader Asia Pacific region. Their comprehensive, end-to-end offerings encompass a range of processes, including semiconductor wafer bumping, probing, back-grinding, package conceptualization, final packaging, testing, and direct shipment services. The company's product portfolio features flip-chip scale packages, critical for devices like smartphones, tablets, and other portable consumer electronics. They also provide flip-chip stacked chip-scale packages, designed for layering memory atop digital basebands and as application processors in mobile units. Flip-chip ball grid array packages cater to diverse applications in networking, data storage, computing, and general consumer products. Wafer-level CSP packages find use in power management systems, transceivers, sensors, wireless charging technologies, codecs, radar systems, and specialized silicon components. Their wafer-level fan-out packages are integral for integrated circuits, alongside silicon wafer integrated fan-out technology, which offers a thinner alternative to traditional laminate substrates. Additionally, Amkor supplies lead frame packages, commonly employed in electronic devices requiring low to medium pin count analog and mixed-signal functionalities. Substrate-based wirebond packages facilitate the connection of a die to its substrate. Micro-electro-mechanical systems (MEMS) packages involve miniature mechanical and electromechanical components. Furthermore, their advanced system-in-package (SiP) modules are vital for a broad array of applications, including radio frequency and front-end modules, basebands, connectivity solutions, fingerprint sensors, display and touchscreen drivers, various sensors and MEMS, and NAND memory and solid-state drives. The company primarily serves a clientele comprising integrated device manufacturers, fabless semiconductor enterprises, original equipment manufacturers, and contract foundries. Established in 1968, Amkor Technology, Inc. maintains its corporate headquarters in Tempe, Arizona.
주가
$41.22
시가총액
$10.24B
변동 (1일)
-1.60%
변동 (1년)
27.70%
국가
US
거래 Amkor Technology, Inc. (AMKR)
카테고리
Technology
Amkor Technology, Inc. (AMKR)의 P/E 비율
October 2026 기준 P/E 비율 TTM: 20.01
Amkor Technology, Inc.의 최신 재무 보고서와 주가에 따르면 현재 P/E (TTM) 비율은 20.01입니다. 2024년 말 기준 P/E 비율은 17.89였습니다.
Amkor Technology, Inc.의 P/E 비율 기록 (2000 ~ 2026)
매년 말 P/E 비율
| 연도 | P/E 비율 | 변화 |
|---|---|---|
| 2026 (TTM) | 20.01 | -100.00% |
| 2025 | 0.00 | -100.00% |
| 2024 | 17.89 | -21.25% |
| 2023 | 22.71 | 196.44% |
| 2022 | 7.66 | -18.52% |
| 2021 | 9.40 | -12.70% |
| 2020 | 10.77 | -58.22% |
| 2019 | 25.78 | 108.69% |
| 2018 | 12.35 | 34.12% |
| 2017 | 9.21 | -39.62% |
| 2016 | 15.26 | -39.02% |
| 2015 | 25.02 | 99.12% |
| 2014 | 12.56 | 19.76% |
| 2013 | 10.49 | -4.17% |
| 2012 | 10.95 | 20.78% |
| 2011 | 9.06 | 54.76% |
| 2010 | 5.86 | -30.32% |
| 2009 | 8.40 | -1,063.36% |
| 2008 | -0.87 | -112.45% |
| 2007 | 7.01 | -28.19% |
| 2006 | 9.76 | -235.22% |
| 2005 | -7.22 | -76.88% |
| 2004 | -31.20 | -102.26% |
| 2003 | 1.38K | -146,085.37% |
| 2002 | -0.94 | -83.08% |
| 2001 | -5.59 | -138.05% |
| 2000 | 14.68 | 0.00% |
유사 기업 또는 경쟁사의 P/E 비율
| 회사 | P/E 비율 | P/E 비율 차이 | 국가 |
|---|---|---|---|
| 27.84 | 39.12% |
US
|
|
| 28.28 | 41.35% |
TW
|
|
| 42.96 | 114.70% |
US
|
|
| 12.14 | -39.34% |
US
|
|
| 144.88 | 624.07% |
US
|
P/E 비율 읽는 방법
P/E 비율은 회사의 주가와 주당순이익 간의 관계를 측정합니다.
낮지만 양수인 P/E는 현재 가치 대비 높은 수익을 내고 있는 저평가된 기업을 의미합니다. 높은 음수(0에 가까운) P/E는 큰 손실을 나타냅니다.
P/E가 30을 초과하거나 음수인 기업은 일반적으로 '성장주'로 간주되며, 투자자들은 향후 수익성 개선을 기대합니다.
양의 P/E가 10 미만인 기업은 일반적으로 '가치주'로 간주되며, 이미 매우 수익성이 높고 향후 큰 성장은 기대되지 않습니다.