Amkor Technology, Inc.
AMKR
주식 순위
#1992
Amkor Technology, Inc. operates internationally, delivering external... Amkor Technology, Inc. operates internationally, delivering external semiconductor packaging and testing solutions across North America, Japan, Europe, the Middle East, Africa, and the broader Asia Pacific region. Their comprehensive, end-to-end offerings encompass a range of processes, including semiconductor wafer bumping, probing, back-grinding, package conceptualization, final packaging, testing, and direct shipment services. The company's product portfolio features flip-chip scale packages, critical for devices like smartphones, tablets, and other portable consumer electronics. They also provide flip-chip stacked chip-scale packages, designed for layering memory atop digital basebands and as application processors in mobile units. Flip-chip ball grid array packages cater to diverse applications in networking, data storage, computing, and general consumer products. Wafer-level CSP packages find use in power management systems, transceivers, sensors, wireless charging technologies, codecs, radar systems, and specialized silicon components. Their wafer-level fan-out packages are integral for integrated circuits, alongside silicon wafer integrated fan-out technology, which offers a thinner alternative to traditional laminate substrates. Additionally, Amkor supplies lead frame packages, commonly employed in electronic devices requiring low to medium pin count analog and mixed-signal functionalities. Substrate-based wirebond packages facilitate the connection of a die to its substrate. Micro-electro-mechanical systems (MEMS) packages involve miniature mechanical and electromechanical components. Furthermore, their advanced system-in-package (SiP) modules are vital for a broad array of applications, including radio frequency and front-end modules, basebands, connectivity solutions, fingerprint sensors, display and touchscreen drivers, various sensors and MEMS, and NAND memory and solid-state drives. The company primarily serves a clientele comprising integrated device manufacturers, fabless semiconductor enterprises, original equipment manufacturers, and contract foundries. Established in 1968, Amkor Technology, Inc. maintains its corporate headquarters in Tempe, Arizona.
주가
$41.76
시가총액
$10.37B
변동 (1일)
-0.16%
변동 (1년)
33.45%
국가
US
거래 Amkor Technology, Inc. (AMKR)
카테고리
Technology
Amkor Technology, Inc. (AMKR)의 배당 이력
Amkor Technology, Inc. (주식 심볼: AMKR)은 총 21회의 배당금을 지급했습니다.
모든 배당금의 합계 (주식 분할 반영): $1.80
배당 수익률 (TTM): 0.0075
모든 배당금의 합계 (주식 분할 반영): $1.80
배당 수익률 (TTM): 0.0075
Amkor Technology, Inc. (AMKR)의 2020부터 2026까지 배당 지급 내역
연간 배당 지급
| 연도 | 배당금 (주식 분할 조정됨) | 변화 |
|---|---|---|
| 2026 (TTM) | $0.0835 | -74.82% |
| 2025 | $0.3316 | -54.24% |
| 2024 | $0.7246 | 138.51% |
| 2023 | $0.3038 | 35.02% |
| 2022 | $0.225 | 32.35% |
| 2021 | $0.17 | 325.00% |
| 2020 | $0.04 | 0.00% |
모든 배당 지급 목록
| 연도 | 배당금 | 변화 |
|---|---|---|
| 2026 (TTM) | $0.0835 | -74.82% |
| 2025 | $0.3316 | -54.24% |
| 2024 | $0.7246 | 138.51% |
| 2023 | $0.3038 | 35.02% |
| 2022 | $0.225 | 32.35% |
| 2021 | $0.17 | 325.00% |
| 2020 | $0.04 | 0.00% |
유사 기업 또는 경쟁사의 배당 지급
| 회사 | 배당 지급 횟수 | 국가 |
|---|---|---|
| 53.00% |
US
|
|
| 44.00% |
TW
|
|
| 61.00% |
US
|
|
| 31.00% |
US
|
|
| 1.00% |
US
|
