Chipbond Technology Corporation
6147
주식 순위
#3490
Chipbond Technology Corporation, along with its affiliated entities,... Chipbond Technology Corporation, along with its affiliated entities, specializes in the research, development, manufacturing, and global distribution of various semiconductor components. Their product portfolio includes advanced metal, gold, and tin-lead bumps, as well as flip chips, tape and reel bonding solutions, and packaging substrates. Operating across Taiwan, the United States, and other international markets, the company delivers comprehensive turnkey services. These encompass diverse bumping manufacturing services (such as gold, solder, and copper bumping), redistribution layer (RDL) processing, and specialized wafer surface treatments like backside metal and dielectric layer coating. Furthermore, they provide wafer grinding, dicing, and precise picking and placing services. Their offerings extend to extensive package and testing services, covering both driver and non-driver integrated circuit testing, driver IC packaging, and wafer-level chip scale packaging (WLCSP). Complementing these are services such as final inspection, detailed failure analysis, and the design and production of chip trays. Beyond these core activities, Chipbond Technology Corporation also engages in the investment, development, manufacturing, and sale of electronic components. They are involved in the entire lifecycle of integrated circuit products and semiconductor-specific materials, from development and production to packaging, testing, and providing after-sales support. Additionally, the company supplies semiconductor components, offers packaging and testing services for semiconductors, and provides various electronic, computer, and communication circuit boards. Established in 1997, the company maintains its headquarters in Hsinchu, Taiwan.
주가
$6.63
시가총액
$4.94B
변동 (1일)
0.24%
변동 (1년)
254.50%
국가
TW
거래 Chipbond Technology Corporation (6147)
카테고리
Technology
Chipbond Technology Corporation (6147)의 P/B 비율
October 2026 기준 P/B 비율 TTM: 2.72
Chipbond Technology Corporation의 최신 재무 보고서와 주가에 따르면 현재 P/B 비율(TTM)은 2.72입니다. 2023년 말 기준 P/B 비율은 1.10였습니다.
Chipbond Technology Corporation의 P/B 비율 기록 (2006 ~ 2026)
매년 말 P/B 비율
| 연도 | P/B 비율 | 변화 |
|---|---|---|
| 2026 (TTM) | 2.72 | 169.26% |
| 2024 | 1.01 | -8.25% |
| 2023 | 1.10 | 6.19% |
| 2022 | 1.04 | -5.00% |
| 2021 | 1.09 | -19.36% |
| 2020 | 1.35 | -8.18% |
| 2019 | 1.47 | 2.14% |
| 2018 | 1.44 | -3.48% |
| 2017 | 1.50 | 18.63% |
| 2016 | 1.26 | -4.01% |
| 2015 | 1.31 | -18.72% |
| 2014 | 1.62 | 25.45% |
| 2013 | 1.29 | -33.74% |
| 2012 | 1.94 | 81.80% |
| 2011 | 1.07 | -37.09% |
| 2010 | 1.70 | 12.09% |
| 2009 | 1.52 | 209.98% |
| 2008 | 0.49 | -69.44% |
| 2007 | 1.60 | 0.51% |
| 2006 | 1.59 | 0.00% |
유사 기업 또는 경쟁사의 P/B 비율
| 회사 | P/B 비율 | P/B 비율 차이 | 국가 |
|---|---|---|---|
| 23.3783 | 759.65% |
US
|
|
| 9.8357 | 261.67% |
TW
|
|
| 16.5536 | 508.70% |
US
|
|
| 7.4648 | 174.49% |
US
|
|
| 13.8493 | 409.26% |
US
|
