Chipbond Technology Corporation
6147
주식 순위
#3500
Chipbond Technology Corporation, along with its affiliated entities,... Chipbond Technology Corporation, along with its affiliated entities, specializes in the research, development, manufacturing, and global distribution of various semiconductor components. Their product portfolio includes advanced metal, gold, and tin-lead bumps, as well as flip chips, tape and reel bonding solutions, and packaging substrates. Operating across Taiwan, the United States, and other international markets, the company delivers comprehensive turnkey services. These encompass diverse bumping manufacturing services (such as gold, solder, and copper bumping), redistribution layer (RDL) processing, and specialized wafer surface treatments like backside metal and dielectric layer coating. Furthermore, they provide wafer grinding, dicing, and precise picking and placing services. Their offerings extend to extensive package and testing services, covering both driver and non-driver integrated circuit testing, driver IC packaging, and wafer-level chip scale packaging (WLCSP). Complementing these are services such as final inspection, detailed failure analysis, and the design and production of chip trays. Beyond these core activities, Chipbond Technology Corporation also engages in the investment, development, manufacturing, and sale of electronic components. They are involved in the entire lifecycle of integrated circuit products and semiconductor-specific materials, from development and production to packaging, testing, and providing after-sales support. Additionally, the company supplies semiconductor components, offers packaging and testing services for semiconductors, and provides various electronic, computer, and communication circuit boards. Established in 1997, the company maintains its headquarters in Hsinchu, Taiwan.
주가
$6.61
마지막 동기화: 2026-10-16
시가총액
$4.92B
변동 (1일)
-2.12%
변동 (1년)
253.64%
국가
TW
거래 Chipbond Technology Corporation (6147)
카테고리
Technology
Chipbond Technology Corporation (6147)의 EPS
June 2026 기준 EPS TTM: $0.13
Chipbond Technology Corporation의 최신 재무 보고서와 주가에 따르면, 현재 EPS (TTM)는 $0.13입니다. 2023년 말에는 회사의 EPS가 $0.18였으며, 이는 2022년의 EPS $0.27와 감소입니다.
Chipbond Technology Corporation의 EPS 기록 (2006 ~ 2026)
매년 말의 EPS
| 연도 | EPS | 변화 |
|---|---|---|
| 2026 (TTM) | $0.13 | -22.18% |
| 2024 | $0.17 | -3.40% |
| 2023 | $0.18 | -35.73% |
| 2022 | $0.27 | -15.52% |
| 2021 | $0.32 | 62.59% |
| 2020 | $0.20 | -4.86% |
| 2019 | $0.21 | -7.66% |
| 2018 | $0.23 | 94.27% |
| 2017 | $0.12 | 23.68% |
| 2016 | $0.09 | -2.37% |
| 2015 | $0.10 | -22.23% |
| 2014 | $0.12 | -10.10% |
| 2013 | $0.14 | -7.04% |
| 2012 | $0.15 | 50.00% |
| 2011 | $0.10 | -36.49% |
| 2010 | $0.16 | 343.34% |
| 2009 | $0.04 | 364.47% |
| 2008 | $0.01 | -92.90% |
| 2007 | $0.11 | 53.74% |
| 2006 | $0.07 | 0.00% |
유사 기업 또는 경쟁사의 EPS
| 회사 | EPS | EPS 차이 | 국가 |
|---|---|---|---|
| $7.95 | 5,909.07% |
US
|
|
| $2.74 | 1,973.54% |
TW
|
|
| $8.06 | 5,992.21% |
US
|
|
| $75.31 | 56,823.66% |
US
|
|
| $3.94 | 2,878.08% |
US
|
