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Winstek Semiconductor Co., Ltd. Winstek Semiconductor Co., Ltd.

Winstek Semiconductor Co., Ltd.

3265
주식 순위 #10622
Winstek Semiconductor Co., Ltd., along with its various subsidiaries, offers... Winstek Semiconductor Co., Ltd., along with its various subsidiaries, offers extensive services in Taiwan, specializing in integrated circuit (IC) testing, wafer bumping, and wafer packaging. Their comprehensive test division provides initial wafer sorting, thorough final and post-production testing, dedicated engineering assistance, and access to advanced test platforms. For wafer bumping, the company delivers a diverse range of solutions, including copper pillar bumps, wafer-level chip scale packaging (WLCSP), lead-free options, plating bump/ball drop/RDL, 6S protection, heterogeneous bumps, and backside metallization. Furthermore, Winstek provides crucial backend services such as die processing, wafer thinning, singulation, and flip-chip integration. They also conduct detailed verification and analysis, which includes failure analysis and reliability assessments. Established in 2000, the company was initially known as Stats ChipPac Taiwan Semiconductor Corp. before officially rebranding to Winstek Semiconductor Co., Ltd. in June 2015. Its main operations are based in Hsinchu City, Taiwan, and it operates as an affiliate of SIGWIN Corporation.
주가
$5.93
마지막 동기화: 2026-08-28
시가총액
$808.10M
변동 (1일)
5.67%
변동 (1년)
76.93%
국가
TW
거래 Winstek Semiconductor Co., Ltd. (3265)

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Winstek Semiconductor Co., Ltd. (3265)의 주식 분할 이력
Winstek Semiconductor Co., Ltd. 주식 (심볼: 3265)은 총 0회의 주식 분할을 거쳤습니다.
가장 최근의 분할은 Aug 30, 2026에 발생했습니다.
Aug 30, 2026 이전에 매수한 3265 주식 1주는 현재 0주의 3265 주식에 해당합니다.
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