Kinsus Interconnect Technology Corp. Kinsus Interconnect Technology Corp.

Kinsus Interconnect Technology Corp.

3189

주식 순위 #1395
Kinsus Interconnect Technology Corp., together with its subsidiaries, engages... Kinsus Interconnect Technology Corp., together with its subsidiaries, engages in the manufacture and sale of electronic products in Taiwan and internationally. It operates through the IC Substrate and Optics segments. The company offers system in package substrate, a carrier substrate that provides a platform for multiple chips or packages or passive components assembly for multi-chip module, multi-chip package, stack die, package in package, and embedded substrates, as well as modules in handset and wearable devices. It also provides plastic ball grid array substrate for microprocessors, controllers, graphic processors, ASIC, and PC chipsets; and flip chip chip scale package substrate for application processors and connectivity applications. In addition, the company offers wire bond chip scale package substrate for application processor, connectivity, power management, and memory applications; radio frequency modules substrate for power amplifier, front end modules, and Wi-Fi connectivity modules applications; and flip chip ball grid array substrate for micro and graphic processors, ASIC, and field programmable gate array applications. In addition, the company is involved in the manufacture and sale of medical equipment; research, development, manufacture, production, and sale of printed circuit boards, electronic components, and related products, as well as provision of after-sales services; and sale of cosmetic products. Further, it is involved in the wholesale and retail-sale of electronic materials; provision of business operation and management consultation services; production, manufacture, and sale of contact lenses; and investment and trading activities. The company was incorporated in 2000 and is based in Taoyuan City, Taiwan.
주가
$30.21
시가총액
$15.92B
변동 (1일)
-3.26%
변동 (1년)
512.31%
국가
TW
거래 Kinsus Interconnect Technology Corp. (3189)

카테고리

Technology
Kinsus Interconnect Technology Corp. (3189)의 주식 분할 이력
Kinsus Interconnect Technology Corp. 주식 (심볼: 3189)은 총 4회의 주식 분할을 거쳤습니다.
가장 최근의 분할은 Jul 24, 2007에 발생했습니다.
Jul 25, 2005 이전에 매수한 3189 주식 1주는 현재 1.46107281408주의 3189 주식에 해당합니다.
주식 분할 목록
연도 주식 분할 배수 누적 배수
2007-07-24 11:10 x1.1 x1.46107281408
2006-08-02 140991:125000 x1.127928 x1.3282480128
2006-04-11 128:125 x1.024 x1.1776
2005-07-25 23:20 x1.15 x1.15
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