Kinsus Interconnect Technology Corp.
3189
주식 순위
#1394
Kinsus Interconnect Technology Corp., together with its subsidiaries, engages... Kinsus Interconnect Technology Corp., together with its subsidiaries, engages in the manufacture and sale of electronic products in Taiwan and internationally. It operates through the IC Substrate and Optics segments. The company offers system in package substrate, a carrier substrate that provides a platform for multiple chips or packages or passive components assembly for multi-chip module, multi-chip package, stack die, package in package, and embedded substrates, as well as modules in handset and wearable devices. It also provides plastic ball grid array substrate for microprocessors, controllers, graphic processors, ASIC, and PC chipsets; and flip chip chip scale package substrate for application processors and connectivity applications. In addition, the company offers wire bond chip scale package substrate for application processor, connectivity, power management, and memory applications; radio frequency modules substrate for power amplifier, front end modules, and Wi-Fi connectivity modules applications; and flip chip ball grid array substrate for micro and graphic processors, ASIC, and field programmable gate array applications. In addition, the company is involved in the manufacture and sale of medical equipment; research, development, manufacture, production, and sale of printed circuit boards, electronic components, and related products, as well as provision of after-sales services; and sale of cosmetic products. Further, it is involved in the wholesale and retail-sale of electronic materials; provision of business operation and management consultation services; production, manufacture, and sale of contact lenses; and investment and trading activities. The company was incorporated in 2000 and is based in Taoyuan City, Taiwan.
주가
$30.21
시가총액
$15.92B
변동 (1일)
-3.26%
변동 (1년)
512.31%
국가
TW
거래 Kinsus Interconnect Technology Corp. (3189)
카테고리
Technology
Kinsus Interconnect Technology Corp. (3189)의 발행 주식 수
June 2026 기준 발행 주식 수: 655.65M
Kinsus Interconnect Technology Corp.의 최신 재무 보고서와 주가에 따르면 현재 발행 주식 수는 655.65M입니다. December 2024 말 기준 회사는 453.76M주를 발행했습니다. 발행 주식 수는 일반적으로 주식 분할이나 자사주 매입에 의해 영향을 받습니다.
Kinsus Interconnect Technology Corp. (3189)의 발행 주식 수 기록 (2004 ~ 2026)
매년 말 기준 발행 주식 수
| 연도 | 발행 주식 수 | 변화 |
|---|---|---|
| 2026 (TTM) | 655.65M | 44.02% |
| 2025 | 455.24M | 0.33% |
| 2024 | 453.76M | -4.50% |
| 2023 | 475.16M | 2.64% |
| 2022 | 462.96M | 14.73% |
| 2021 | 403.53M | -10.64% |
| 2020 | 451.60M | 0.81% |
| 2019 | 447.96M | -0.02% |
| 2018 | 448.06M | 0.24% |
| 2017 | 446.98M | -0.95% |
| 2016 | 451.25M | -0.86% |
| 2015 | 455.16M | 0.41% |
| 2014 | 453.30M | 0.11% |
| 2013 | 452.82M | -0.04% |
| 2012 | 453.01M | 1.57% |
| 2011 | 446.00M | 0.00% |
| 2010 | 446.00M | 0.00% |
| 2009 | 446.00M | 0.00% |
| 2008 | 446.00M | 0.00% |
| 2007 | 446.00M | 8.44% |
| 2006 | 411.30M | 19.34% |
| 2005 | 344.64M | 5.72% |
| 2004 | 325.98M | 0.00% |
유사 기업 또는 경쟁사의 발행 주식 수
| 회사 | 발행 주식 수 | 차이 | 국가 |
|---|---|---|---|
| 24.19B | 3,589.48% |
US
|
|
| 25.93B | 3,854.83% |
TW
|
|
| 4.77B | 626.91% |
US
|
|
| 1.13B | 72.35% |
US
|
|
| 1.63B | 148.76% |
US
|
