Kinsus Interconnect Technology Corp.
3189
주식 순위
#1394
Kinsus Interconnect Technology Corp., together with its subsidiaries, engages... Kinsus Interconnect Technology Corp., together with its subsidiaries, engages in the manufacture and sale of electronic products in Taiwan and internationally. It operates through the IC Substrate and Optics segments. The company offers system in package substrate, a carrier substrate that provides a platform for multiple chips or packages or passive components assembly for multi-chip module, multi-chip package, stack die, package in package, and embedded substrates, as well as modules in handset and wearable devices. It also provides plastic ball grid array substrate for microprocessors, controllers, graphic processors, ASIC, and PC chipsets; and flip chip chip scale package substrate for application processors and connectivity applications. In addition, the company offers wire bond chip scale package substrate for application processor, connectivity, power management, and memory applications; radio frequency modules substrate for power amplifier, front end modules, and Wi-Fi connectivity modules applications; and flip chip ball grid array substrate for micro and graphic processors, ASIC, and field programmable gate array applications. In addition, the company is involved in the manufacture and sale of medical equipment; research, development, manufacture, production, and sale of printed circuit boards, electronic components, and related products, as well as provision of after-sales services; and sale of cosmetic products. Further, it is involved in the wholesale and retail-sale of electronic materials; provision of business operation and management consultation services; production, manufacture, and sale of contact lenses; and investment and trading activities. The company was incorporated in 2000 and is based in Taoyuan City, Taiwan.
주가
$30.21
시가총액
$15.92B
변동 (1일)
-3.26%
변동 (1년)
512.31%
국가
TW
거래 Kinsus Interconnect Technology Corp. (3189)
카테고리
Technology
Kinsus Interconnect Technology Corp. (3189)의 P/E 비율
October 2026 기준 P/E 비율 TTM: 169.11
Kinsus Interconnect Technology Corp.의 최신 재무 보고서와 주가에 따르면 현재 P/E (TTM) 비율은 169.11입니다. 2024년 말 기준 P/E 비율은 937.42였습니다.
Kinsus Interconnect Technology Corp.의 P/E 비율 기록 (2004 ~ 2026)
매년 말 P/E 비율
| 연도 | P/E 비율 | 변화 |
|---|---|---|
| 2026 (TTM) | 169.11 | -100.00% |
| 2025 | 0.00 | -100.00% |
| 2024 | 937.42 | -4.54% |
| 2023 | 982.00 | 14,061.49% |
| 2022 | 6.93 | -71.54% |
| 2021 | 24.36 | -63.86% |
| 2020 | 67.42 | -688.43% |
| 2019 | -11.46 | -120.64% |
| 2018 | 55.51 | 11.43% |
| 2017 | 49.82 | 246.35% |
| 2016 | 14.38 | 37.17% |
| 2015 | 10.49 | -20.69% |
| 2014 | 13.22 | -4.82% |
| 2013 | 13.89 | -7.60% |
| 2012 | 15.03 | 17.32% |
| 2011 | 12.81 | -28.83% |
| 2010 | 18.00 | -9.50% |
| 2009 | 19.89 | 218.36% |
| 2008 | 6.25 | -46.61% |
| 2007 | 11.70 | 28.44% |
| 2006 | 9.11 | -44.85% |
| 2005 | 16.52 | 77.70% |
| 2004 | 9.30 | 0.00% |
유사 기업 또는 경쟁사의 P/E 비율
| 회사 | P/E 비율 | P/E 비율 차이 | 국가 |
|---|---|---|---|
| 27.84 | -83.54% |
US
|
|
| 28.28 | -83.28% |
TW
|
|
| 42.96 | -74.60% |
US
|
|
| 12.14 | -92.82% |
US
|
|
| 144.88 | -14.33% |
US
|
P/E 비율 읽는 방법
P/E 비율은 회사의 주가와 주당순이익 간의 관계를 측정합니다.
낮지만 양수인 P/E는 현재 가치 대비 높은 수익을 내고 있는 저평가된 기업을 의미합니다. 높은 음수(0에 가까운) P/E는 큰 손실을 나타냅니다.
P/E가 30을 초과하거나 음수인 기업은 일반적으로 '성장주'로 간주되며, 투자자들은 향후 수익성 개선을 기대합니다.
양의 P/E가 10 미만인 기업은 일반적으로 '가치주'로 간주되며, 이미 매우 수익성이 높고 향후 큰 성장은 기대되지 않습니다.