Kinsus Interconnect Technology Corp.
3189
주식 순위
#1357
Kinsus Interconnect Technology Corp., together with its subsidiaries, engages... Kinsus Interconnect Technology Corp., together with its subsidiaries, engages in the manufacture and sale of electronic products in Taiwan and internationally. It operates through the IC Substrate and Optics segments. The company offers system in package substrate, a carrier substrate that provides a platform for multiple chips or packages or passive components assembly for multi-chip module, multi-chip package, stack die, package in package, and embedded substrates, as well as modules in handset and wearable devices. It also provides plastic ball grid array substrate for microprocessors, controllers, graphic processors, ASIC, and PC chipsets; and flip chip chip scale package substrate for application processors and connectivity applications. In addition, the company offers wire bond chip scale package substrate for application processor, connectivity, power management, and memory applications; radio frequency modules substrate for power amplifier, front end modules, and Wi-Fi connectivity modules applications; and flip chip ball grid array substrate for micro and graphic processors, ASIC, and field programmable gate array applications. In addition, the company is involved in the manufacture and sale of medical equipment; research, development, manufacture, production, and sale of printed circuit boards, electronic components, and related products, as well as provision of after-sales services; and sale of cosmetic products. Further, it is involved in the wholesale and retail-sale of electronic materials; provision of business operation and management consultation services; production, manufacture, and sale of contact lenses; and investment and trading activities. The company was incorporated in 2000 and is based in Taoyuan City, Taiwan.
주가
$31.23
시가총액
$16.45B
변동 (1일)
-1.80%
변동 (1년)
533.57%
국가
TW
거래 Kinsus Interconnect Technology Corp. (3189)
카테고리
Technology
Kinsus Interconnect Technology Corp. (3189)의 배당 이력
Kinsus Interconnect Technology Corp. (주식 심볼: 3189)은 총 21회의 배당금을 지급했습니다.
모든 배당금의 합계 (주식 분할 반영): $53.68
배당 수익률 (TTM): 0.0015
모든 배당금의 합계 (주식 분할 반영): $53.68
배당 수익률 (TTM): 0.0015
Kinsus Interconnect Technology Corp. (3189)의 2005부터 2026까지 배당 지급 내역
연간 배당 지급
| 연도 | 배당금 (주식 분할 조정됨) | 변화 |
|---|---|---|
| 2026 (TTM) | $1.00 | 0.00% |
| 2025 | $1.00 | 0.01% |
| 2024 | $1.00 | -84.56% |
| 2023 | $6.48 | 43.90% |
| 2022 | $4.50 | 350.00% |
| 2021 | $1.00 | -0.04% |
| 2020 | $1.00 | -33.27% |
| 2019 | $1.50 | -0.06% |
| 2018 | $1.50 | -50.00% |
| 2017 | $3.00 | -14.29% |
| 2016 | $3.50 | -12.50% |
| 2015 | $4.00 | 14.29% |
| 2014 | $3.50 | 16.67% |
| 2013 | $3.00 | 0.00% |
| 2012 | $3.00 | 0.00% |
| 2011 | $3.00 | 30.43% |
| 2010 | $2.30 | 15.00% |
| 2009 | $2.00 | -49.75% |
| 2008 | $3.98 | 46.67% |
| 2007 | $2.71 | 164.49% |
| 2006 | $1.03 | 50.66% |
| 2005 | $0.681 | 0.00% |
모든 배당 지급 목록
| 연도 | 배당금 | 변화 |
|---|---|---|
| 2026 (TTM) | $1.00 | 0.00% |
| 2025 | $1.00 | 0.01% |
| 2024 | $1.00 | -84.56% |
| 2023 | $6.48 | 43.90% |
| 2022 | $4.50 | 350.00% |
| 2021 | $1.00 | -0.04% |
| 2020 | $1.00 | -33.27% |
| 2019 | $1.50 | -0.06% |
| 2018 | $1.50 | -50.00% |
| 2017 | $3.00 | -14.29% |
| 2016 | $3.50 | -12.50% |
| 2015 | $4.00 | 14.29% |
| 2014 | $3.50 | 16.67% |
| 2013 | $3.00 | 0.00% |
| 2012 | $3.00 | 0.00% |
| 2011 | $3.00 | 30.43% |
| 2010 | $2.30 | 15.00% |
| 2009 | $2.00 | -49.75% |
| 2008 | $3.98 | 46.67% |
| 2007 | $2.71 | 164.49% |
| 2006 | $1.03 | 6.33% |
| 2005 | $0.9649 | 0.00% |
유사 기업 또는 경쟁사의 배당 지급
| 회사 | 배당 지급 횟수 | 국가 |
|---|---|---|
| 53.00% |
US
|
|
| 44.00% |
TW
|
|
| 61.00% |
US
|
|
| 31.00% |
US
|
|
| 1.00% |
US
|
