Winbond Electronics Corporation
2344
주식 순위
#1067
Winbond Electronics Corporation is a global enterprise specializing in the... Winbond Electronics Corporation is a global enterprise specializing in the entire lifecycle of very large scale integration (VLSI) integrated circuits (ICs). This encompasses the design, development, manufacturing, and worldwide distribution of these components for a broad spectrum of microelectronic applications across Asia, the Americas, and Europe. The company organizes its operations into three primary product divisions: DRAM IC, Flash Memory, and Logic IC products. Its extensive portfolio features a diverse range of Dynamic Random-Access Memory (DRAM) devices. For mobile uses, these include pseudo static RAM (SRAM), HyperRAM, various low-power synchronous DRAM (SDR SDRAM), and double-data-rate (DDR) SDRAM standards (such as DDR1, DDR2, DDR3, and DDR4/4X), along with Known Good Die (KGD) formats. Furthermore, Winbond offers specialty DRAM units like standard SDRAM, DDR, DDR2, and DDR3 SDRAM, also available as KGD. In the realm of flash memory, the company provides solutions specifically for code storage, which consist of serial NOR flash, QspiNAND Flash, Single-Level Cell (SLC) NAND Flash, NAND-Based Multi-Chip Packages (MCP), SpiStack Flash NAND, and TrustME secure flash memory. Additionally, Winbond supplies a selection of logic integrated circuits. These sophisticated semiconductor components are integral to numerous high-technology sectors. Their widespread applications span computing, telecommunications, and general consumer electronics, extending to critical automotive and industrial control systems. They are also crucial for contemporary personal devices like smartphones, tablets, low-power mobile handhelds, and wearable technology, as well as the burgeoning Internet of Things (IoT). Further uses include powering personal computers and their associated peripherals, modules for mobile handheld devices, network communication equipment, and household appliance control units. Winbond markets its products through an established network of distributors and directly via online channels. Beyond its core manufacturing and sales, the company is deeply involved in comprehensive research, development, and design activities, providing dedicated post-sales support for its semiconductor and 6-inch wafer products. The corporation also operates in e-commerce, offers specialized testing services, serves as an Original Equipment Manufacturer (OEM), provides computer software services, and delivers expert consulting. Moreover, it includes a wholesale division for computer hardware, accessories, and software, in addition to handling project-specific sales. Established in 1987, Winbond Electronics Corporation maintains its principal corporate office in Taichung, Taiwan.
주가
$4.88
시가총액
$21.97B
변동 (1일)
-1.29%
변동 (1년)
222.31%
국가
TW
거래 Winbond Electronics Corporation (2344)
카테고리
Technology
Winbond Electronics Corporation (2344)의 발행 주식 수
June 2026 기준 발행 주식 수: 4.50B
Winbond Electronics Corporation의 최신 재무 보고서와 주가에 따르면 현재 발행 주식 수는 4.50B입니다. December 2023 말 기준 회사는 3.95B주를 발행했습니다. 발행 주식 수는 일반적으로 주식 분할이나 자사주 매입에 의해 영향을 받습니다.
Winbond Electronics Corporation (2344)의 발행 주식 수 기록 (2006 ~ 2026)
매년 말 기준 발행 주식 수
| 연도 | 발행 주식 수 | 변화 |
|---|---|---|
| 2026 (TTM) | 4.50B | 4.61% |
| 2024 | 4.30B | 8.80% |
| 2023 | 3.95B | -1.53% |
| 2022 | 4.01B | 0.00% |
| 2021 | 4.01B | 0.00% |
| 2020 | 4.01B | 0.00% |
| 2019 | 4.01B | 0.87% |
| 2018 | 3.98B | 10.28% |
| 2017 | 3.61B | 1.02% |
| 2016 | 3.57B | -2.31% |
| 2015 | 3.66B | -1.32% |
| 2014 | 3.71B | -0.64% |
| 2013 | 3.73B | 1.45% |
| 2012 | 3.68B | -1.00% |
| 2011 | 3.71B | 0.41% |
| 2010 | 3.70B | 0.09% |
| 2009 | 3.70B | -0.72% |
| 2008 | 3.72B | -0.96% |
| 2007 | 3.76B | -2.25% |
| 2006 | 3.84B | 0.00% |
유사 기업 또는 경쟁사의 발행 주식 수
| 회사 | 발행 주식 수 | 차이 | 국가 |
|---|---|---|---|
| 24.19B | 437.56% |
US
|
|
| 25.93B | 476.22% |
TW
|
|
| 4.77B | 5.91% |
US
|
|
| 1.13B | -74.89% |
US
|
|
| 1.63B | -63.76% |
US
|
