LB Semicon, Inc.
061970
주식 순위
#18925
LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South... LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South Korea. It offers wafer-level packaging technology for packaging and testing integrated circuits; gold bumped wafers, which are applied on various packages, such as chip on glass, chip on film, and chip on plastic; solder bumps for various flip chip packages; Cu pillar bumps; Au RDL, which is used to reposition the layout of the I/O pad; and thick Cu products. The company also provides chip probe test; and back-end services, such as laminating, back grinding, laser marking and grooving, SAW, plasma, post AVI, UV irradiation, pick and place, AVI, visual inspection and packing services, as well as back side coating, foil mount, and tape and reel. LB Semicon Inc. was founded in 2000 and is based in Pyeongtaek-Si, South Korea.
주가
$2.43
시가총액
$170.10M
변동 (1일)
-2.36%
변동 (1년)
-36.10%
국가
KR
거래 LB Semicon, Inc. (061970)
카테고리
Technology
LB Semicon, Inc. (061970)의 EPS
2026 기준 EPS TTM: 0
LB Semicon, Inc.의 최신 재무 보고서와 주가에 따르면, 현재 EPS (TTM)는 0입니다. 2026년 말에는 회사의 EPS가 0였으며, 이는 2026년의 EPS 0와 동일입니다.
LB Semicon, Inc.의 EPS 기록 (2026 ~ 2026)
매년 말의 EPS
| 연도 | EPS | 변화 |
|---|---|---|
| 제공된 날짜에 대한 데이터가 충분하지 않습니다. | ||
유사 기업 또는 경쟁사의 EPS
| 회사 | EPS | EPS 차이 | 국가 |
|---|---|---|---|
| $7.95 | - |
US
|
|
| $2.74 | - |
TW
|
|
| $8.06 | - |
US
|
|
| $75.31 | - |
US
|
|
| $3.94 | - |
US
|
