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Bondada Engineering Limited Bondada Engineering Limited

Bondada Engineering Limited

BONDADA
株式のランク #15437
Bondada Engineering Ltd. is a specialist in providing comprehensive solutions... Bondada Engineering Ltd. is a specialist in providing comprehensive solutions encompassing design, engineering, and construction for both communication infrastructure and solar energy projects. The company delivers extensive passive telecom infrastructure services, which involve turnkey solutions for constructing cellular sites. This includes the erection, ongoing operation, and maintenance of telecommunication towers, addressing civil, electrical, and mechanical requirements. Additionally, it supplies crucial components such as poles and towers, handles the deployment and upkeep of optical fiber cable networks, and furnishes a variety of power equipment along with other essential services for telecom infrastructure. Its primary clientele consists of major telecommunication providers and tower operators across India. Established by Raghavendra Rao Bondada on March 29, 2012, the company's central operations are based in Hyderabad, India.
株価
$3.16
時価総額
$352.34M
変化(1日)
3.83%
変化(1年)
-30.54%
IN
取引 Bondada Engineering Limited (BONDADA)

カテゴリー

Bondada Engineering Limited(BONDADA)の配当履歴
Bondada Engineering Limited(証券コード:BONDADA)は合計で0回の配当を行いました。
すべての配当の合計(株式分割調整済み)は:0.00
配当利回り(TTM):0
2026から2026までのBondada Engineering Limited(BONDADA)の配当履歴
年間配当支払い
配当(株式分割調整済み) 変化
提供された日付のデータは十分ではありません。
すべての配当支払いの一覧
配当 変化
提供された日付のデータは十分ではありません。
同業他社や競合企業の配当履歴
企業 配当支払い回数
29.00%
US
53.00%
FR
28.00%
IN
81.00%
US
0.00%
NL