BE Semiconductor Industries N.V.
BESI
株式のランク
#1498
BE Semiconductor Industries N.V. (BESI) specializes in the creation,... BE Semiconductor Industries N.V. (BESI) specializes in the creation, manufacturing, global distribution, and servicing of advanced machinery vital for semiconductor assembly within the electronics and chip manufacturing industries. Its extensive product portfolio features sophisticated die attach equipment, encompassing systems for single-chip, multi-chip, multi-module, flip-chip, thermal compression bonding, fan-out wafer level packaging, hybrid and embedded bridge die bonding, and die sorting. Additionally, BESI provides a variety of packaging solutions, including conventional, ultra-thin, and wafer-level molding, alongside trim and form, and singulation systems. The company also offers plating equipment for tin, copper, precious metals, and solar applications, complete with their corresponding process chemicals. Supplemental to its core machinery, BESI supplies critical tooling, conversion kits, spare components, and various support services. With well-known brand names like Datacon, Esec, Fico, and Meco, the company primarily serves major multinational chip producers, assembly outsourcing specialists, and diverse electronics and industrial enterprises. Established in 1995, BE Semiconductor Industries N.V. maintains its headquarters in Duiven, Netherlands.
株価
$184.45
最終同期: 2026-10-20
時価総額
$14.59B
変化（1日）
-3.33%
変化（1年）
37.02%
国
NL
取引 BE Semiconductor Industries N.V. (BESI)
カテゴリー
Technology
BE Semiconductor Industries N.V.（BESI）の株式分割履歴
BE Semiconductor Industries N.V.株（シンボル：BESI）は合計で0回の株式分割を実施しました。
最新の株式分割はOct 21, 2026に行われました。
Oct 21, 2026より前に購入されたBESI株は、現在0BESI株に相当します。
最新の株式分割はOct 21, 2026に行われました。
Oct 21, 2026より前に購入されたBESI株は、現在0BESI株に相当します。
株式分割一覧
| 年 | 株式分割 | 分割比率 | 累積分割比率 |
|---|---|---|---|
| 提供された日付のデータは十分ではありません。 | |||
類似企業または競合他社の株式分割
| 企業 | 株式分割の回数 | 累積分割比率 | 国 |
|---|---|---|---|
| 6 | x480 |
US
|
|
| 11 | x12 |
TW
|
|
| 1 | x10 |
US
|
|
| 3 | x10 |
US
|
|
| 6 | x26 |
US
|
