BE Semiconductor Industries N.V.
BESI
株式のランク
#1501
BE Semiconductor Industries N.V. (BESI) specializes in the creation,... BE Semiconductor Industries N.V. (BESI) specializes in the creation, manufacturing, global distribution, and servicing of advanced machinery vital for semiconductor assembly within the electronics and chip manufacturing industries. Its extensive product portfolio features sophisticated die attach equipment, encompassing systems for single-chip, multi-chip, multi-module, flip-chip, thermal compression bonding, fan-out wafer level packaging, hybrid and embedded bridge die bonding, and die sorting. Additionally, BESI provides a variety of packaging solutions, including conventional, ultra-thin, and wafer-level molding, alongside trim and form, and singulation systems. The company also offers plating equipment for tin, copper, precious metals, and solar applications, complete with their corresponding process chemicals. Supplemental to its core machinery, BESI supplies critical tooling, conversion kits, spare components, and various support services. With well-known brand names like Datacon, Esec, Fico, and Meco, the company primarily serves major multinational chip producers, assembly outsourcing specialists, and diverse electronics and industrial enterprises. Established in 1995, BE Semiconductor Industries N.V. maintains its headquarters in Duiven, Netherlands.
株価
$184.45
最終同期: 2026-10-20
時価総額
$14.59B
変化（1日）
-3.33%
変化（1年）
37.02%
国
NL
取引 BE Semiconductor Industries N.V. (BESI)
カテゴリー
Technology
BE Semiconductor Industries N.V.（BESI）のP/S比率
2026 時点のP/S比率 TTM: 0
BE Semiconductor Industries N.V. の最新の財務報告および株価によると、現在のP/S比率（TTM）は 0 です。2026 年末時点でのP/S比率は 0 でした。
BE Semiconductor Industries N.V. の P/S 比率の履歴（2026 ～ 2026）
各年末時点のP/S比率
| 年 | P/S比率 | 変化 |
|---|---|---|
| 提供された日付のデータは十分ではありません。 | ||
同業他社のP/S比率
| 企業 | P/S比率 | P/S比率の差 | 国 |
|---|---|---|---|
| 17.60 | - |
US
|
|
| 14.25 | - |
TW
|
|
| 18.55 | - |
US
|
|
| 7.75 | - |
US
|
|
| 22.53 | - |
US
|
