BE Semiconductor Industries N.V.
BESI
株式のランク
#1476
BE Semiconductor Industries N.V. (BESI) specializes in the creation,... BE Semiconductor Industries N.V. (BESI) specializes in the creation, manufacturing, global distribution, and servicing of advanced machinery vital for semiconductor assembly within the electronics and chip manufacturing industries. Its extensive product portfolio features sophisticated die attach equipment, encompassing systems for single-chip, multi-chip, multi-module, flip-chip, thermal compression bonding, fan-out wafer level packaging, hybrid and embedded bridge die bonding, and die sorting. Additionally, BESI provides a variety of packaging solutions, including conventional, ultra-thin, and wafer-level molding, alongside trim and form, and singulation systems. The company also offers plating equipment for tin, copper, precious metals, and solar applications, complete with their corresponding process chemicals. Supplemental to its core machinery, BESI supplies critical tooling, conversion kits, spare components, and various support services. With well-known brand names like Datacon, Esec, Fico, and Meco, the company primarily serves major multinational chip producers, assembly outsourcing specialists, and diverse electronics and industrial enterprises. Established in 1995, BE Semiconductor Industries N.V. maintains its headquarters in Duiven, Netherlands.
株価
$185.57
時価総額
$14.68B
変化（1日）
-2.74%
変化（1年）
37.86%
国
NL
取引 BE Semiconductor Industries N.V. (BESI)
カテゴリー
Technology
BE Semiconductor Industries N.V.（BESI）の配当履歴
BE Semiconductor Industries N.V.（証券コード：BESI）は合計で0回の配当を行いました。
すべての配当の合計（株式分割調整済み）は：0.00
配当利回り（TTM）：0
すべての配当の合計（株式分割調整済み）は：0.00
配当利回り（TTM）：0
2026から2026までのBE Semiconductor Industries N.V.（BESI）の配当履歴
年間配当支払い
| 年 | 配当（株式分割調整済み） | 変化 |
|---|---|---|
| 提供された日付のデータは十分ではありません。 | ||
すべての配当支払いの一覧
| 年 | 配当 | 変化 |
|---|---|---|
| 提供された日付のデータは十分ではありません。 | ||
同業他社や競合企業の配当履歴
| 企業 | 配当支払い回数 | 国 |
|---|---|---|
| 53.00% |
US
|
|
| 44.00% |
TW
|
|
| 61.00% |
US
|
|
| 31.00% |
US
|
|
| 1.00% |
US
|
