BE Semiconductor Industries N.V.
BESI
株式のランク
#1500
BE Semiconductor Industries N.V. (BESI) specializes in the creation,... BE Semiconductor Industries N.V. (BESI) specializes in the creation, manufacturing, global distribution, and servicing of advanced machinery vital for semiconductor assembly within the electronics and chip manufacturing industries. Its extensive product portfolio features sophisticated die attach equipment, encompassing systems for single-chip, multi-chip, multi-module, flip-chip, thermal compression bonding, fan-out wafer level packaging, hybrid and embedded bridge die bonding, and die sorting. Additionally, BESI provides a variety of packaging solutions, including conventional, ultra-thin, and wafer-level molding, alongside trim and form, and singulation systems. The company also offers plating equipment for tin, copper, precious metals, and solar applications, complete with their corresponding process chemicals. Supplemental to its core machinery, BESI supplies critical tooling, conversion kits, spare components, and various support services. With well-known brand names like Datacon, Esec, Fico, and Meco, the company primarily serves major multinational chip producers, assembly outsourcing specialists, and diverse electronics and industrial enterprises. Established in 1995, BE Semiconductor Industries N.V. maintains its headquarters in Duiven, Netherlands.
株価
$184.45
時価総額
$14.59B
変化（1日）
-3.33%
変化（1年）
37.02%
国
NL
取引 BE Semiconductor Industries N.V. (BESI)
カテゴリー
Technology
BE Semiconductor Industries N.V.（BESI）の配当利回りの履歴
BE Semiconductor Industries N.V.（銘柄コード: BESI）の配当利回り（TTM）は2026時点で0です。
過去5年間の平均配当利回り: 0.00%
過去5年間の平均配当利回り: 0.00%
BE Semiconductor Industries N.V.（BESI）の2026から2026までの配当利回りの履歴
各年末時点の配当利回り（TTM）
| 年 | 配当利回り | 変化 |
|---|---|---|
| 提供された日付のデータは十分ではありません。 | ||
類似企業または競合他社の配当利回り（TTM）
| 企業 | 配当利回り | 国 |
|---|---|---|
| 0.23% |
US
|
|
| 0.98% |
TW
|
|
| 0.75% |
US
|
|
| 0.06% |
US
|
|
| 0.00% |
US
|
