Amkor Technology, Inc.
AMKR
株式のランク
#2015
Amkor Technology, Inc. operates internationally, delivering external... Amkor Technology, Inc. operates internationally, delivering external semiconductor packaging and testing solutions across North America, Japan, Europe, the Middle East, Africa, and the broader Asia Pacific region. Their comprehensive, end-to-end offerings encompass a range of processes, including semiconductor wafer bumping, probing, back-grinding, package conceptualization, final packaging, testing, and direct shipment services. The company's product portfolio features flip-chip scale packages, critical for devices like smartphones, tablets, and other portable consumer electronics. They also provide flip-chip stacked chip-scale packages, designed for layering memory atop digital basebands and as application processors in mobile units. Flip-chip ball grid array packages cater to diverse applications in networking, data storage, computing, and general consumer products. Wafer-level CSP packages find use in power management systems, transceivers, sensors, wireless charging technologies, codecs, radar systems, and specialized silicon components. Their wafer-level fan-out packages are integral for integrated circuits, alongside silicon wafer integrated fan-out technology, which offers a thinner alternative to traditional laminate substrates. Additionally, Amkor supplies lead frame packages, commonly employed in electronic devices requiring low to medium pin count analog and mixed-signal functionalities. Substrate-based wirebond packages facilitate the connection of a die to its substrate. Micro-electro-mechanical systems (MEMS) packages involve miniature mechanical and electromechanical components. Furthermore, their advanced system-in-package (SiP) modules are vital for a broad array of applications, including radio frequency and front-end modules, basebands, connectivity solutions, fingerprint sensors, display and touchscreen drivers, various sensors and MEMS, and NAND memory and solid-state drives. The company primarily serves a clientele comprising integrated device manufacturers, fabless semiconductor enterprises, original equipment manufacturers, and contract foundries. Established in 1968, Amkor Technology, Inc. maintains its corporate headquarters in Tempe, Arizona.
株価
$41.90
時価総額
$10.41B
変化（1日）
0.02%
変化（1年）
29.80%
国
US
取引 Amkor Technology, Inc. (AMKR)
カテゴリー
Technology
Amkor Technology, Inc.（AMKR）のP/B比率
October 2026 時点のP/B比率 TTM: 2.39
Amkor Technology, Inc. の最新の財務報告および株価によると、現在のP/B比率（TTM）は 2.39 です。2024 年末時点でのP/B比率は 1.53 でした。
Amkor Technology, Inc. の P/B 比率の履歴（2000 ～ 2026）
各年末時点のP/B比率
| 年 | P/B比率 | 変化 |
|---|---|---|
| 2026 (TTM) | 2.39 | -100.00% |
| 2025 | 0.00 | -100.00% |
| 2024 | 1.53 | -26.01% |
| 2023 | 2.06 | 28.96% |
| 2022 | 1.60 | -22.17% |
| 2021 | 2.05 | 31.21% |
| 2020 | 1.57 | -1.32% |
| 2019 | 1.59 | 85.03% |
| 2018 | 0.86 | -40.45% |
| 2017 | 1.44 | -20.44% |
| 2016 | 1.81 | 51.93% |
| 2015 | 1.19 | -18.81% |
| 2014 | 1.47 | 22.08% |
| 2013 | 1.20 | 20.09% |
| 2012 | 1.00 | -16.59% |
| 2011 | 1.20 | -44.34% |
| 2010 | 2.16 | -36.97% |
| 2009 | 3.42 | 103.61% |
| 2008 | 1.68 | -28.62% |
| 2007 | 2.35 | -44.14% |
| 2006 | 4.21 | -4.33% |
| 2005 | 4.40 | 38.93% |
| 2004 | 3.17 | -58.08% |
| 2003 | 7.56 | 123.92% |
| 2002 | 3.38 | 35.24% |
| 2001 | 2.50 | 45.06% |
| 2000 | 1.72 | 0.00% |
同業他社のP/B比率
| 企業 | P/B比率 | P/B比率の差 | 国 |
|---|---|---|---|
| 23.3783 | 879.85% |
US
|
|
| 9.8357 | 312.24% |
TW
|
|
| 16.5536 | 593.81% |
US
|
|
| 7.4648 | 212.87% |
US
|
|
| 13.8493 | 480.46% |
US
|
