Powertech Technology Inc. Powertech Technology Inc.

Powertech Technology Inc.

6239

株式のランク #3051
Powertech Technology Inc., together with its subsidiaries, researches, designs,... Powertech Technology Inc., together with its subsidiaries, researches, designs, develops, assembles, manufactures, packages, tests, and sells various integrated circuit (IC) products in Taiwan, Japan, Singapore, the United States, Europe, China, Hong Kong, Macao, and internationally. It provides chip probing and final test; IC packaging services, such as wafer level packing, flip chips, wire bond BGA, lead frame, and system in package; module assembly services; and quality management services. The company is also involved in the design, manufacturing, assembly, testing, and sale of semiconductors; metal surface treatment on semiconductor wire frame; and metal plating on semiconductor lead frame, as well as in investment and wafer probing testing activities. Powertech Technology Inc. was incorporated in 1997 and is headquartered in Hsinchu City, Taiwan.
株価
$8.12
時価総額
$6.00B
変化(1日)
-2.85%
変化(1年)
59.40%
国
TW
取引 Powertech Technology Inc. (6239)

カテゴリー

Technology
Powertech Technology Inc.(6239)のP/B比率
October 2026 時点のP/B比率 TTM: 3.50
Powertech Technology Inc. の最新の財務報告および株価によると、現在のP/B比率(TTM)は 3.50 です。2023 年末時点でのP/B比率は 1.92 でした。
Powertech Technology Inc. の P/B 比率の履歴(2006 ~ 2026)
各年末時点のP/B比率
年 P/B比率 変化
2026 (TTM) 3.50 117.53%
2024 1.61 -16.38%
2023 1.92 69.34%
2022 1.13 -25.45%
2021 1.52 -4.79%
2020 1.60 -11.31%
2019 1.80 43.65%
2018 1.25 -30.15%
2017 1.80 -5.13%
2016 1.89 27.27%
2015 1.49 13.15%
2014 1.31 11.63%
2013 1.18 15.09%
2012 1.02 -28.61%
2011 1.43 -28.28%
2010 2.00 -30.00%
2009 2.85 78.28%
2008 1.60 -57.04%
2007 3.73 -23.42%
2006 4.87 0.00%
同業他社のP/B比率
企業 P/B比率 P/B比率の差 国
23.3783 567.51%
US
9.8357 180.84%
TW
16.5536 372.65%
US
7.4648 113.14%
US
13.8493 295.43%
US