Powertech Technology Inc.
6239
株式のランク
#3042
Powertech Technology Inc., together with its subsidiaries, researches, designs,... Powertech Technology Inc., together with its subsidiaries, researches, designs, develops, assembles, manufactures, packages, tests, and sells various integrated circuit (IC) products in Taiwan, Japan, Singapore, the United States, Europe, China, Hong Kong, Macao, and internationally. It provides chip probing and final test; IC packaging services, such as wafer level packing, flip chips, wire bond BGA, lead frame, and system in package; module assembly services; and quality management services. The company is also involved in the design, manufacturing, assembly, testing, and sale of semiconductors; metal surface treatment on semiconductor wire frame; and metal plating on semiconductor lead frame, as well as in investment and wafer probing testing activities. Powertech Technology Inc. was incorporated in 1997 and is headquartered in Hsinchu City, Taiwan.
株価
$8.12
時価総額
$6.00B
変化（1日）
-2.85%
変化（1年）
59.40%
国
TW
取引 Powertech Technology Inc. (6239)
カテゴリー
Technology
Powertech Technology Inc.（6239）の配当利回りの履歴
Powertech Technology Inc.（銘柄コード: 6239）の配当利回り（TTM）は2023-12-31時点で4.96%です。
過去5年間の平均配当利回り: 5.83%
過去5年間の平均配当利回り: 5.83%
Powertech Technology Inc.（6239）の2006から2026までの配当利回りの履歴
各年末時点の配当利回り（TTM）
| 年 | 配当利回り | 変化 |
|---|---|---|
| 2026 (TTM) | 1.66% | -71.08% |
| 2024 | 5.74% | 15.73% |
| 2023 | 4.96% | -42.19% |
| 2022 | 8.58% | 67.58% |
| 2021 | 5.12% | 8.02% |
| 2020 | 4.74% | -1.46% |
| 2019 | 4.81% | -29.26% |
| 2018 | 6.80% | 49.12% |
| 2017 | 4.56% | 13.43% |
| 2016 | 4.02% | -12.80% |
| 2015 | 4.61% | 24.93% |
| 2014 | 3.69% | -43.92% |
| 2013 | 6.58% | 53.02% |
| 2012 | 4.30% | -24.16% |
| 2011 | 5.67% | 56.63% |
| 2010 | 3.62% | 38.17% |
| 2009 | 2.62% | -65.16% |
| 2008 | 7.52% | 156.66% |
| 2007 | 2.93% | 36.92% |
| 2006 | 2.14% | 0.00% |
類似企業または競合他社の配当利回り（TTM）
| 企業 | 配当利回り | 国 |
|---|---|---|
| 0.23% |
US
|
|
| 0.98% |
TW
|
|
| 0.75% |
US
|
|
| 0.06% |
US
|
|
| 0.00% |
US
|
