Chipbond Technology Corporation
6147
株式のランク
#3569
Chipbond Technology Corporation, along with its affiliated entities,... Chipbond Technology Corporation, along with its affiliated entities, specializes in the research, development, manufacturing, and global distribution of various semiconductor components. Their product portfolio includes advanced metal, gold, and tin-lead bumps, as well as flip chips, tape and reel bonding solutions, and packaging substrates. Operating across Taiwan, the United States, and other international markets, the company delivers comprehensive turnkey services. These encompass diverse bumping manufacturing services (such as gold, solder, and copper bumping), redistribution layer (RDL) processing, and specialized wafer surface treatments like backside metal and dielectric layer coating. Furthermore, they provide wafer grinding, dicing, and precise picking and placing services. Their offerings extend to extensive package and testing services, covering both driver and non-driver integrated circuit testing, driver IC packaging, and wafer-level chip scale packaging (WLCSP). Complementing these are services such as final inspection, detailed failure analysis, and the design and production of chip trays. Beyond these core activities, Chipbond Technology Corporation also engages in the investment, development, manufacturing, and sale of electronic components. They are involved in the entire lifecycle of integrated circuit products and semiconductor-specific materials, from development and production to packaging, testing, and providing after-sales support. Additionally, the company supplies semiconductor components, offers packaging and testing services for semiconductors, and provides various electronic, computer, and communication circuit boards. Established in 1997, the company maintains its headquarters in Hsinchu, Taiwan.
株価
$6.41
時価総額
$4.77B
変化（1日）
-3.36%
変化（1年）
237.54%
国
TW
取引 Chipbond Technology Corporation (6147)
カテゴリー
Technology
Chipbond Technology Corporation（6147）のP/E比率
October 2026 時点のP/E比率 TTM 51.56
Chipbond Technology Corporation の最新の財務報告および株価によると、現在の P/E (TTM) は 51.56 です。2023 年末時点での P/E は 13.36 でした。
Chipbond Technology Corporation の P/E 比率の履歴（2006 〜 2026）
各年末のP/E比率
| 年 | P/E比率 | 変化 |
|---|---|---|
| 2026 (TTM) | 51.56 | 347.59% |
| 2024 | 11.52 | -13.82% |
| 2023 | 13.36 | 95.69% |
| 2022 | 6.83 | -7.87% |
| 2021 | 7.41 | -37.42% |
| 2020 | 11.84 | 10.67% |
| 2019 | 10.70 | 20.12% |
| 2018 | 8.91 | -45.16% |
| 2017 | 16.25 | 8.49% |
| 2016 | 14.98 | 0.42% |
| 2015 | 14.91 | 1.59% |
| 2014 | 14.68 | 29.69% |
| 2013 | 11.32 | -15.69% |
| 2012 | 13.43 | 36.83% |
| 2011 | 9.81 | -12.17% |
| 2010 | 11.17 | -57.79% |
| 2009 | 26.46 | -23.76% |
| 2008 | 34.71 | 280.23% |
| 2007 | 9.13 | -25.74% |
| 2006 | 12.29 | 0.00% |
類似企業や競合他社のP/E比率
| 企業 | P/E比率 | P/E比率の差 | 国 |
|---|---|---|---|
| 27.84 | -46.01% |
US
|
|
| 28.28 | -45.15% |
TW
|
|
| 42.96 | -16.69% |
US
|
|
| 12.14 | -76.46% |
US
|
|
| 144.88 | 180.98% |
US
|
P/E比率の読み方
株価収益率（P/E Ratio）は、企業の株価と1株あたり利益の関係を示します。
低いが正のP/Eは、現在の評価額に対して高い利益を上げている企業を示し、割安と見なされる可能性があります。高い負の（0に近い）P/Eは、損失が大きいことを示します。
P/Eが30を超えるか、負である企業は一般に「成長株」と見なされ、投資家は将来的な成長または黒字化を期待しています。
10未満の正のP/Eを持つ企業は一般に「割安株」と見なされ、既に収益性が高いが成長の余地は小さいと見なされます。