Chipbond Technology Corporation
6147
株式のランク
#3572
Chipbond Technology Corporation, along with its affiliated entities,... Chipbond Technology Corporation, along with its affiliated entities, specializes in the research, development, manufacturing, and global distribution of various semiconductor components. Their product portfolio includes advanced metal, gold, and tin-lead bumps, as well as flip chips, tape and reel bonding solutions, and packaging substrates. Operating across Taiwan, the United States, and other international markets, the company delivers comprehensive turnkey services. These encompass diverse bumping manufacturing services (such as gold, solder, and copper bumping), redistribution layer (RDL) processing, and specialized wafer surface treatments like backside metal and dielectric layer coating. Furthermore, they provide wafer grinding, dicing, and precise picking and placing services. Their offerings extend to extensive package and testing services, covering both driver and non-driver integrated circuit testing, driver IC packaging, and wafer-level chip scale packaging (WLCSP). Complementing these are services such as final inspection, detailed failure analysis, and the design and production of chip trays. Beyond these core activities, Chipbond Technology Corporation also engages in the investment, development, manufacturing, and sale of electronic components. They are involved in the entire lifecycle of integrated circuit products and semiconductor-specific materials, from development and production to packaging, testing, and providing after-sales support. Additionally, the company supplies semiconductor components, offers packaging and testing services for semiconductors, and provides various electronic, computer, and communication circuit boards. Established in 1997, the company maintains its headquarters in Hsinchu, Taiwan.
株価
$6.41
時価総額
$4.77B
変化（1日）
-3.36%
変化（1年）
237.54%
国
TW
取引 Chipbond Technology Corporation (6147)
カテゴリー
Technology
Chipbond Technology Corporation（6147）のP/B比率
October 2026 時点のP/B比率 TTM: 2.72
Chipbond Technology Corporation の最新の財務報告および株価によると、現在のP/B比率（TTM）は 2.72 です。2023 年末時点でのP/B比率は 1.10 でした。
Chipbond Technology Corporation の P/B 比率の履歴（2006 ～ 2026）
各年末時点のP/B比率
| 年 | P/B比率 | 変化 |
|---|---|---|
| 2026 (TTM) | 2.72 | 169.26% |
| 2024 | 1.01 | -8.25% |
| 2023 | 1.10 | 6.19% |
| 2022 | 1.04 | -5.00% |
| 2021 | 1.09 | -19.36% |
| 2020 | 1.35 | -8.18% |
| 2019 | 1.47 | 2.14% |
| 2018 | 1.44 | -3.48% |
| 2017 | 1.50 | 18.63% |
| 2016 | 1.26 | -4.01% |
| 2015 | 1.31 | -18.72% |
| 2014 | 1.62 | 25.45% |
| 2013 | 1.29 | -33.74% |
| 2012 | 1.94 | 81.80% |
| 2011 | 1.07 | -37.09% |
| 2010 | 1.70 | 12.09% |
| 2009 | 1.52 | 209.98% |
| 2008 | 0.49 | -69.44% |
| 2007 | 1.60 | 0.51% |
| 2006 | 1.59 | 0.00% |
同業他社のP/B比率
| 企業 | P/B比率 | P/B比率の差 | 国 |
|---|---|---|---|
| 23.3783 | 759.65% |
US
|
|
| 9.8357 | 261.67% |
TW
|
|
| 16.5536 | 508.70% |
US
|
|
| 7.4648 | 174.49% |
US
|
|
| 13.8493 | 409.26% |
US
|
