Chipbond Technology Corporation
6147
株式のランク
#3500
Chipbond Technology Corporation, along with its affiliated entities,... Chipbond Technology Corporation, along with its affiliated entities, specializes in the research, development, manufacturing, and global distribution of various semiconductor components. Their product portfolio includes advanced metal, gold, and tin-lead bumps, as well as flip chips, tape and reel bonding solutions, and packaging substrates. Operating across Taiwan, the United States, and other international markets, the company delivers comprehensive turnkey services. These encompass diverse bumping manufacturing services (such as gold, solder, and copper bumping), redistribution layer (RDL) processing, and specialized wafer surface treatments like backside metal and dielectric layer coating. Furthermore, they provide wafer grinding, dicing, and precise picking and placing services. Their offerings extend to extensive package and testing services, covering both driver and non-driver integrated circuit testing, driver IC packaging, and wafer-level chip scale packaging (WLCSP). Complementing these are services such as final inspection, detailed failure analysis, and the design and production of chip trays. Beyond these core activities, Chipbond Technology Corporation also engages in the investment, development, manufacturing, and sale of electronic components. They are involved in the entire lifecycle of integrated circuit products and semiconductor-specific materials, from development and production to packaging, testing, and providing after-sales support. Additionally, the company supplies semiconductor components, offers packaging and testing services for semiconductors, and provides various electronic, computer, and communication circuit boards. Established in 1997, the company maintains its headquarters in Hsinchu, Taiwan.
株価
$6.61
最終同期: 2026-10-16
時価総額
$4.92B
変化（1日）
-2.12%
変化（1年）
253.64%
国
TW
取引 Chipbond Technology Corporation (6147)
カテゴリー
Technology
Chipbond Technology Corporation（6147）の営業利益率
October 2026 時点の営業利益率 TTM: 13.60%
Chipbond Technology Corporation の最新の財務報告と株価によると、現在の営業利益率（TTM）は 13.60% です。2023 年末時点では 16.58% でした。
Chipbond Technology Corporation の営業利益率の履歴（2006 から 2026）
各年末の営業利益率
| 年 | 営業利益率 | 変化 |
|---|---|---|
| 2026 (TTM) | 13.60% | 8.80% |
| 2024 | 12.50% | -24.61% |
| 2023 | 16.58% | -48.40% |
| 2022 | 32.13% | 16.37% |
| 2021 | 27.61% | 36.82% |
| 2020 | 20.18% | -22.53% |
| 2019 | 26.05% | 25.06% |
| 2018 | 20.83% | 20.40% |
| 2017 | 17.30% | 7.79% |
| 2016 | 16.05% | 6.22% |
| 2015 | 15.11% | -10.96% |
| 2014 | 16.97% | -0.82% |
| 2013 | 17.11% | -20.53% |
| 2012 | 21.53% | 29.00% |
| 2011 | 16.69% | -28.03% |
| 2010 | 23.19% | 192.80% |
| 2009 | 7.92% | 28.57% |
| 2008 | 6.16% | -69.18% |
| 2007 | 19.99% | 30.82% |
| 2006 | 15.28% | 0.00% |
同業他社の営業利益率
| 企業 | 営業利益率 | 営業利益率の差 | 国 |
|---|---|---|---|
| 65.21% | -95.21% |
US
|
|
| 56.04% | -95.88% |
TW
|
|
| 48.36% | -96.44% |
US
|
|
| 75.01% | -94.48% |
US
|
|
| 15.71% | -98.84% |
US
|
企業の営業利益率とは？
営業利益率は、企業の収益性を評価するための重要な指標です。高い営業利益率は一般的に良いとされており、企業が製品やサービスをその生産コストよりもはるかに高く販売できていることを示します。営業利益率は、企業の利益を売上高で割ることで計算されます。