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3s Silicon Tech., Inc. 3s Silicon Tech., Inc.

3s Silicon Tech., Inc.

5297
株式のランク #22755
3s Silicon Tech., Inc., established in 1998 and headquartered in Hsinchu,... 3s Silicon Tech., Inc., established in 1998 and headquartered in Hsinchu, Taiwan, specializes in providing die bonding solutions for discrete power devices to customers both locally and globally. Their comprehensive product line includes advanced clip die bonders for power devices, which incorporate functionalities such as clip attachment and precise pick-and-place capabilities. The company also offers a diverse range of snap ovens, encompassing standard models, units with vacuum reflow processes, formic acid reflow ovens, and flux eutectic reflow ovens, alongside complete power module assembly automation solutions. Additionally, 3s Silicon Tech. engineers custom automation equipment tailored for both power device and power discrete assembly. Clients can also utilize their open lab platform for thorough product and fabrication process verification.
株価
$2.23
最終同期: 2026-08-21
時価総額
$83.81M
変化（1日）
-0.57%
変化（1年）
130.82%
国
TW
取引 3s Silicon Tech., Inc. (5297)

カテゴリー

Technology
3s Silicon Tech., Inc.（5297）の配当履歴
3s Silicon Tech., Inc.（証券コード：5297）は合計で0回の配当を行いました。
すべての配当の合計（株式分割調整済み）は：0.00
配当利回り（TTM）：0
2026から2026までの3s Silicon Tech., Inc.（5297）の配当履歴
年間配当支払い
年 配当（株式分割調整済み） 変化
提供された日付のデータは十分ではありません。
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年 配当 変化
提供された日付のデータは十分ではありません。
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