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3s Silicon Tech., Inc. 3s Silicon Tech., Inc.

3s Silicon Tech., Inc.

5297
株式のランク #22755
3s Silicon Tech., Inc., established in 1998 and headquartered in Hsinchu,... 3s Silicon Tech., Inc., established in 1998 and headquartered in Hsinchu, Taiwan, specializes in providing die bonding solutions for discrete power devices to customers both locally and globally. Their comprehensive product line includes advanced clip die bonders for power devices, which incorporate functionalities such as clip attachment and precise pick-and-place capabilities. The company also offers a diverse range of snap ovens, encompassing standard models, units with vacuum reflow processes, formic acid reflow ovens, and flux eutectic reflow ovens, alongside complete power module assembly automation solutions. Additionally, 3s Silicon Tech. engineers custom automation equipment tailored for both power device and power discrete assembly. Clients can also utilize their open lab platform for thorough product and fabrication process verification.
株価
$2.23
最終同期: 2026-08-21
時価総額
$83.81M
変化(1日)
-0.57%
変化(1年)
130.82%
TW
取引 3s Silicon Tech., Inc. (5297)

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3s Silicon Tech., Inc.(5297)の配当利回りの履歴
3s Silicon Tech., Inc.(銘柄コード: 5297)の配当利回り(TTM)は2026時点で0です。
過去5年間の平均配当利回り: 0.00%
3s Silicon Tech., Inc.(5297)の2026から2026までの配当利回りの履歴
各年末時点の配当利回り(TTM)
配当利回り 変化
提供された日付のデータは十分ではありません。
類似企業または競合他社の配当利回り(TTM)