HPSP Co., Ltd.
403870
株式のランク
#5024
HPSP Co., Ltd. is an enterprise engaged in the manufacturing and global sales... HPSP Co., Ltd. is an enterprise engaged in the manufacturing and global sales of specialized high-pressure annealing equipment for the semiconductor industry, serving markets in South Korea and worldwide. Its product lineup encompasses the GENI-SYS, an advanced high-pressure thermal processing unit, alongside the GENI high-pressure thermal processing system, and the GENI-SE, which is designed for high-pressure oxidation applications. Furthermore, the company provides comprehensive support services such as the supply of spare parts, repair and exchange programs for components, assistance with installation, and ongoing technical guidance. Established in 2005, HPSP Co., Ltd. operates from its headquarters in Suwon, South Korea.
株価
$35.68
時価総額
$2.90B
変化（1日）
3.20%
変化（1年）
42.10%
国
KR
取引 HPSP Co., Ltd. (403870)
カテゴリー
Technology
HPSP Co., Ltd.（403870）の配当利回りの履歴
HPSP Co., Ltd.（銘柄コード: 403870）の配当利回り（TTM）は2023-12-31時点で0.05%です。
過去5年間の平均配当利回り: 0.95%
過去5年間の平均配当利回り: 0.95%
HPSP Co., Ltd.（403870）の2018から2026までの配当利回りの履歴
各年末時点の配当利回り（TTM）
| 年 | 配当利回り | 変化 |
|---|---|---|
| 2026 (TTM) | 1.20% | 242.86% |
| 2024 | 0.35% | 600.00% |
| 2023 | 0.05% | -95.54% |
| 2022 | 1.12% | -52.14% |
| 2021 | 2.34% | 162.92% |
| 2020 | 0.89% | 8,800.00% |
| 2019 | 0.01% | -98.75% |
| 2018 | 0.80% | 0.00% |
類似企業または競合他社の配当利回り（TTM）
| 企業 | 配当利回り | 国 |
|---|---|---|
| 0.23% |
US
|
|
| 0.98% |
TW
|
|
| 0.75% |
US
|
|
| 0.06% |
US
|
|
| 0.00% |
US
|
