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Taiwan IC Packaging Corporation Taiwan IC Packaging Corporation

Taiwan IC Packaging Corporation

3372
株式のランク #22494
Taiwan IC Packaging Corporation is dedicated to developing advanced integrated... Taiwan IC Packaging Corporation is dedicated to developing advanced integrated circuit (IC) packaging technologies, particularly focusing on optical and ultra-slim designs. Its extensive product catalog features a wide array of IC package types, including thin small outline (TSOP), small outline (SOP), SSOP/TSSOP, quad flat no-lead (QFN)/dual flat no-lead (DFN), thin PKG, TQFP, quad flat (QFP), LQFP, thermally enhanced versions, and specialized image sensor packages. Beyond these, the firm also offers substrate-based packaging solutions like LGA, VLGA, and packaging for micro-SD and SD cards. Founded in 1998, the company is headquartered in Kaohsiung, Taiwan.
株価
$0.48016532
最終同期: 2026-08-21
時価総額
$87.70M
変化(1日)
1.34%
変化(1年)
11.79%
TW
取引 Taiwan IC Packaging Corporation (3372)

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Taiwan IC Packaging Corporation(3372)のP/S比率
2026 時点のP/S比率 TTM: 0
Taiwan IC Packaging Corporation の最新の財務報告および株価によると、現在のP/S比率(TTM)は 0 です。2026 年末時点でのP/S比率は 0 でした。
Taiwan IC Packaging Corporation の P/S 比率の履歴(2026 ~ 2026)
各年末時点のP/S比率
P/S比率 変化
提供された日付のデータは十分ではありません。
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