Kinsus Interconnect Technology Corp. Kinsus Interconnect Technology Corp.

Kinsus Interconnect Technology Corp.

3189

株式のランク #1334
Kinsus Interconnect Technology Corp., together with its subsidiaries, engages... Kinsus Interconnect Technology Corp., together with its subsidiaries, engages in the manufacture and sale of electronic products in Taiwan and internationally. It operates through the IC Substrate and Optics segments. The company offers system in package substrate, a carrier substrate that provides a platform for multiple chips or packages or passive components assembly for multi-chip module, multi-chip package, stack die, package in package, and embedded substrates, as well as modules in handset and wearable devices. It also provides plastic ball grid array substrate for microprocessors, controllers, graphic processors, ASIC, and PC chipsets; and flip chip chip scale package substrate for application processors and connectivity applications. In addition, the company offers wire bond chip scale package substrate for application processor, connectivity, power management, and memory applications; radio frequency modules substrate for power amplifier, front end modules, and Wi-Fi connectivity modules applications; and flip chip ball grid array substrate for micro and graphic processors, ASIC, and field programmable gate array applications. In addition, the company is involved in the manufacture and sale of medical equipment; research, development, manufacture, production, and sale of printed circuit boards, electronic components, and related products, as well as provision of after-sales services; and sale of cosmetic products. Further, it is involved in the wholesale and retail-sale of electronic materials; provision of business operation and management consultation services; production, manufacture, and sale of contact lenses; and investment and trading activities. The company was incorporated in 2000 and is based in Taoyuan City, Taiwan.
株価
$31.96
時価総額
$16.84B
変化(1日)
6.35%
変化(1年)
554.04%
国
TW
取引 Kinsus Interconnect Technology Corp. (3189)

カテゴリー

Technology
Kinsus Interconnect Technology Corp.(3189)のP/E比率
October 2026 時点のP/E比率 TTM 169.11
Kinsus Interconnect Technology Corp. の最新の財務報告および株価によると、現在の P/E (TTM) は 169.11 です。2024 年末時点での P/E は 937.42 でした。
Kinsus Interconnect Technology Corp. の P/E 比率の履歴(2004 〜 2026)
各年末のP/E比率
年 P/E比率 変化
2026 (TTM) 169.11 -100.00%
2025 0.00 -100.00%
2024 937.42 -4.54%
2023 982.00 14,061.49%
2022 6.93 -71.54%
2021 24.36 -63.86%
2020 67.42 -688.43%
2019 -11.46 -120.64%
2018 55.51 11.43%
2017 49.82 246.35%
2016 14.38 37.17%
2015 10.49 -20.69%
2014 13.22 -4.82%
2013 13.89 -7.60%
2012 15.03 17.32%
2011 12.81 -28.83%
2010 18.00 -9.50%
2009 19.89 218.36%
2008 6.25 -46.61%
2007 11.70 28.44%
2006 9.11 -44.85%
2005 16.52 77.70%
2004 9.30 0.00%
類似企業や競合他社のP/E比率
企業 P/E比率 P/E比率の差 国
27.84 -83.54%
US
28.28 -83.28%
TW
42.96 -74.60%
US
12.14 -92.82%
US
144.88 -14.33%
US
P/E比率の読み方

株価収益率(P/E Ratio)は、企業の株価と1株あたり利益の関係を示します。
低いが正のP/Eは、現在の評価額に対して高い利益を上げている企業を示し、割安と見なされる可能性があります。高い負の(0に近い)P/Eは、損失が大きいことを示します。

P/Eが30を超えるか、負である企業は一般に「成長株」と見なされ、投資家は将来的な成長または黒字化を期待しています。

10未満の正のP/Eを持つ企業は一般に「割安株」と見なされ、既に収益性が高いが成長の余地は小さいと見なされます。