Kinsus Interconnect Technology Corp.
3189
株式のランク
#1356
Kinsus Interconnect Technology Corp., together with its subsidiaries, engages... Kinsus Interconnect Technology Corp., together with its subsidiaries, engages in the manufacture and sale of electronic products in Taiwan and internationally. It operates through the IC Substrate and Optics segments. The company offers system in package substrate, a carrier substrate that provides a platform for multiple chips or packages or passive components assembly for multi-chip module, multi-chip package, stack die, package in package, and embedded substrates, as well as modules in handset and wearable devices. It also provides plastic ball grid array substrate for microprocessors, controllers, graphic processors, ASIC, and PC chipsets; and flip chip chip scale package substrate for application processors and connectivity applications. In addition, the company offers wire bond chip scale package substrate for application processor, connectivity, power management, and memory applications; radio frequency modules substrate for power amplifier, front end modules, and Wi-Fi connectivity modules applications; and flip chip ball grid array substrate for micro and graphic processors, ASIC, and field programmable gate array applications. In addition, the company is involved in the manufacture and sale of medical equipment; research, development, manufacture, production, and sale of printed circuit boards, electronic components, and related products, as well as provision of after-sales services; and sale of cosmetic products. Further, it is involved in the wholesale and retail-sale of electronic materials; provision of business operation and management consultation services; production, manufacture, and sale of contact lenses; and investment and trading activities. The company was incorporated in 2000 and is based in Taoyuan City, Taiwan.
株価
$31.23
時価総額
$16.45B
変化（1日）
-1.80%
変化（1年）
533.57%
国
TW
取引 Kinsus Interconnect Technology Corp. (3189)
カテゴリー
Technology
Kinsus Interconnect Technology Corp.（3189）の配当履歴
Kinsus Interconnect Technology Corp.（証券コード：3189）は合計で21回の配当を行いました。
すべての配当の合計（株式分割調整済み）は：$53.68
配当利回り（TTM）：0.0015
すべての配当の合計（株式分割調整済み）は：$53.68
配当利回り（TTM）：0.0015
2005から2026までのKinsus Interconnect Technology Corp.（3189）の配当履歴
年間配当支払い
| 年 | 配当（株式分割調整済み） | 変化 |
|---|---|---|
| 2026 (TTM) | $1.00 | 0.00% |
| 2025 | $1.00 | 0.01% |
| 2024 | $1.00 | -84.56% |
| 2023 | $6.48 | 43.90% |
| 2022 | $4.50 | 350.00% |
| 2021 | $1.00 | -0.04% |
| 2020 | $1.00 | -33.27% |
| 2019 | $1.50 | -0.06% |
| 2018 | $1.50 | -50.00% |
| 2017 | $3.00 | -14.29% |
| 2016 | $3.50 | -12.50% |
| 2015 | $4.00 | 14.29% |
| 2014 | $3.50 | 16.67% |
| 2013 | $3.00 | 0.00% |
| 2012 | $3.00 | 0.00% |
| 2011 | $3.00 | 30.43% |
| 2010 | $2.30 | 15.00% |
| 2009 | $2.00 | -49.75% |
| 2008 | $3.98 | 46.67% |
| 2007 | $2.71 | 164.49% |
| 2006 | $1.03 | 50.66% |
| 2005 | $0.681 | 0.00% |
すべての配当支払いの一覧
| 年 | 配当 | 変化 |
|---|---|---|
| 2026 (TTM) | $1.00 | 0.00% |
| 2025 | $1.00 | 0.01% |
| 2024 | $1.00 | -84.56% |
| 2023 | $6.48 | 43.90% |
| 2022 | $4.50 | 350.00% |
| 2021 | $1.00 | -0.04% |
| 2020 | $1.00 | -33.27% |
| 2019 | $1.50 | -0.06% |
| 2018 | $1.50 | -50.00% |
| 2017 | $3.00 | -14.29% |
| 2016 | $3.50 | -12.50% |
| 2015 | $4.00 | 14.29% |
| 2014 | $3.50 | 16.67% |
| 2013 | $3.00 | 0.00% |
| 2012 | $3.00 | 0.00% |
| 2011 | $3.00 | 30.43% |
| 2010 | $2.30 | 15.00% |
| 2009 | $2.00 | -49.75% |
| 2008 | $3.98 | 46.67% |
| 2007 | $2.71 | 164.49% |
| 2006 | $1.03 | 6.33% |
| 2005 | $0.9649 | 0.00% |
同業他社や競合企業の配当履歴
| 企業 | 配当支払い回数 | 国 |
|---|---|---|
| 53.00% |
US
|
|
| 44.00% |
TW
|
|
| 61.00% |
US
|
|
| 31.00% |
US
|
|
| 1.00% |
US
|
